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Preparing method of flexible OLED display screen thin film

A display and flexible technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as the reduction of water and oxygen barrier capacity, OLED failure, and impact on display effects, to ensure the barrier effect and low cost , the effect of a wide range of raw materials

Active Publication Date: 2017-06-13
汇精(厦门)电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such a protective layer is easy to break when the flexible display device is bent, which greatly reduces the water and oxygen barrier ability, affects the display effect, and may even lead to OLED failure.

Method used

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  • Preparing method of flexible OLED display screen thin film
  • Preparing method of flexible OLED display screen thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] The present embodiment comprises the following steps:

[0032] (1) Ultrasonic cleaning in ethanol solution for 10 minutes to remove the grease on the surface of the plastic substrate, and then rinse with deionized water to remove the salt on the surface of the plastic substrate, the purity is 99.9% at 40°C, and the argon at an ambient pressure of 100Pa Dry the plastic substrate under air protection to obtain a clean plastic substrate;

[0033] (2) On the clean plastic substrate, using an evaporation temperature of 100°C, under vacuum, evaporate methyl acrylate monomer with a thickness of 50nm, and set the substrate temperature to 50°C, so that the acrylic acid evaporated to the substrate The methyl ester monomer is polymerized and cured, and the curing time is 30 minutes. After curing, it condenses into a flexible and transparent film;

[0034] (3) Then SiO 2 The dense film layer of inorganic medium is deposited on the polymer thin film layer by radio frequency sputte...

Embodiment 2

[0037] The present embodiment comprises the following steps:

[0038](1) Ultrasonic cleaning in ethanol solution for 10 minutes to remove the grease on the surface of the plastic substrate, and then rinse with deionized water to remove the salt on the surface of the plastic substrate, the purity is 99.9% at 45°C, and the ambient pressure is argon at 300Pa Dry the plastic substrate under air protection to obtain a clean plastic substrate;

[0039] (2) On the clean plastic substrate, use an evaporation temperature of 100°C to evaporate ethyl acrylate monomer with a thickness of 100nm under vacuum, and set the substrate temperature to 60°C so that the acrylic acid evaporated to the substrate Ethyl monomer is polymerized and cured, and the curing time is 40 minutes. After curing, it condenses into a flexible and transparent film;

[0040] (3) Then the TiO 2 The dense film layer of inorganic medium is deposited on the polymer film layer by radio frequency sputtering. The paramete...

Embodiment 3

[0043] The present embodiment comprises the following steps:

[0044] (1) Ultrasonic cleaning in ethanol solution for 12 minutes to remove the grease on the surface of the plastic substrate, then rinse with deionized water to remove the salt on the surface of the plastic substrate, the purity is 99.9% at 45°C, and the argon at an ambient pressure of 300Pa Dry the plastic substrate under air protection to obtain a clean plastic substrate;

[0045] (2) On the clean plastic substrate, use an evaporation temperature of 110°C to evaporate ethyl acrylate monomer with a thickness of 140nm under vacuum, and set the substrate temperature to 70°C, so that the acrylic acid evaporated to the substrate Ethyl monomer is polymerized and cured, and the curing time is 40 minutes. After curing, it condenses into a flexible and transparent film;

[0046] (3) Then put Al 2 o 3 The dense film layer of inorganic medium is deposited on the polymer thin film layer by radio frequency sputtering. 2...

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Abstract

The invention provides a preparing method of flexible OLED display screen thin film. By adopting an acrylic acid type resin monomer as an organic film raw material, acrylic acid and a derivative monomer are evaporated on a plastic substrate, and are polymerized into film through a curing method, the surface condition of the plastic substrate is improved to make the surface smooth, and through a radio frequency magnetron sputtering method, then an inorganic medium dense film layer is prepared on an organic film to be adopted as a barrier to obstruct water and oxygen. According to the preparing method of the flexible OLED display screen thin film, the technical defects are overcome that in a technology that an existing flexible display device is encapsulated, the protective layer is prone to fractures when adopted to fold the flexible display device, thus the ability to obstruct water and oxygen is lowered by a large margin, and the display effect is influenced. The prepared thin film can effectively obstruct water and oxygen from invading into the display screen, the material is prevented from aging, and the service life of an OLED device is prolonged.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a flexible OLED display film. Background technique [0002] Organic light-emitting display is a display that uses organic light-emitting diodes (OLED) as light-emitting devices. With the advantages of low power consumption and thinner volume, it is expected to become the next-generation flat panel display technology after LCD, and it is one of the most concerned technologies in flat panel display technology at present. [0003] OLED devices are very sensitive to water vapor and oxygen, and are prone to attenuation. Effective packaging can prevent the intrusion of water vapor and oxygen, prevent the aging of organic materials, and prolong the life of OLED devices. At present, flexible OLED mainly has two packaging methods: cover plate encapsulation and thin film encapsulation (TFE). Cover plate encapsulation uses a prefabricated cover plate for encapsulati...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/84H10K50/8426H10K71/00
Inventor 陈庆曾军堂王镭迪
Owner 汇精(厦门)电子科技有限公司
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