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Flexible electronic device and manufacturing method thereof

A technology of flexible electronic devices and manufacturing methods, applied in semiconductor/solid-state device manufacturing, electrical solid-state devices, electrical components and other directions, can solve problems such as explosion, flexible substrate circuit failure, and flexible substrate barrier performance degradation, and achieve effective guarantees. performance, low equipment cost, and improved performance

Inactive Publication Date: 2017-06-23
AAC TECH NANJING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] 2. The barrier performance of the flexible substrate is reduced
When the ultraviolet laser laser scans these foreign objects P / T, due to the high temperature generated by energy accumulation, these foreign objects will be instantly ashed and "exploded", resulting in the failure of the circuit made on the flexible substrate.

Method used

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  • Flexible electronic device and manufacturing method thereof
  • Flexible electronic device and manufacturing method thereof
  • Flexible electronic device and manufacturing method thereof

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Embodiment Construction

[0036] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0037] see figure 1 , is a process flow chart of the manufacturing method of the flexible electronic device provided by the present invention. The manufacturing method of the flexible electronic device comprises the steps of:

[0038] Step S1: providing a rigid substrate 11, on which a photoresponsive release layer 12, a sacrificial layer 13 and a flexible substrate body 14 are sequentially formed (see figure 1 (a), (b));

[0039] Specifically, by coating the precursor of the photoresponsive release layer 12 on the rigid substrate 11, and then curing at a high temperature to form the photoresponsive release layer 12 of the trans isomer structure; Depositing and forming the sacrificial layer 13 on the photoresponsive release layer 12; then manufacturing and molding the flexible substrate main body 14 sequentially according to conventional LED technolo...

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Abstract

The invention discloses a method for manufacturing a flexible electronic device. The method comprises steps of: providing a rigid substrate and successively manufacturing a light-responsive release layer, a sacrificial layer and a flexible substrate body on the rigid substrate; successively forming an electronic device and a packaging film on the flexible substrate body; applying ultraviolet light to a side of the light-responsive release layer so that the light-responsive release layer generates molecular configuration conversion so as to be warped; and stripping the warped light-responsive layer from the rigid substrate, wherein a part of the light-responsive release layer separated from the rigid substrate, the sacrificial layer, the flexible substrate body, the electronic device, and the packaging film form the flexible electronic device. The method for manufacturing the flexible electronic device has no stripping damage and can improve the performance of the electronic device. The invention also provides a flexible electronic device manufactured by the manufacturing method.

Description

[0001] 【Technical field】 [0002] The invention relates to the technical field of light-emitting diode display devices, in particular to a flexible electronic device and a manufacturing method thereof. [0003] 【Background technique】 [0004] Organic Light-Emitting Diode (OLED) devices can be used as light sources for display devices and lighting devices, and have been more and more widely used, especially in the technical field of electronic products. Among them, flexible OLED display technology that can be bent arbitrarily is the development technology direction of smart phones in the future, and has broad application prospects. The Samsung S6Edge product uses a flexible OLED display device, which can realize edge bending and narrow frame display, and the user experience is good. [0005] In the manufacturing process of the flexible OLED device, the rigid substrate is used as the carrier, and the OLED device is manufactured on the rigid substrate, so as to ensure the flatnes...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/78H01L51/00H01L51/56H10K99/00
CPCH01L21/7813H10K71/80H10K71/00
Inventor 谢再锋
Owner AAC TECH NANJING
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