A kind of light-curable ink resistant to gold plating solution and its application

A light-curing ink and potion technology, applied in inks, applications, household appliances, etc., can solve the problems of inability to meet the high precision of PCB, resolution depends on precision, poor resistance to gold plating potion, etc., to improve the performance of gold plating potion, High resolution, good resistance to gold plating potion

Active Publication Date: 2020-11-03
SHANGHAI PHICHEM MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In the process of realizing the present invention, the inventor and the inventor have found that the prior art has at least the following problems: the resolution of the existing thermosetting ink depends on the precision of the screen printing used for screen printing, so its resolution is low and cannot Meet the requirements of PCB high precision
Moreover, the protective layer formed after the existing heat-curing ink is cured has low hardness, poor resistance to gold-plating chemicals, and is prone to scratches and seepage.

Method used

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  • A kind of light-curable ink resistant to gold plating solution and its application
  • A kind of light-curable ink resistant to gold plating solution and its application
  • A kind of light-curable ink resistant to gold plating solution and its application

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preparation example Construction

[0056] Further, in the above-mentioned photocurable ink, the esterified styrene-maleic anhydride copolymer resin can be obtained through esterification reaction between alcohol and styrene-maleic anhydride copolymer resin. The specific synthesis method includes: polymerizing maleic anhydride and styrene to obtain styrene-maleic anhydride copolymer resin; reaction to obtain esterified styrene maleic anhydride copolymer resin. The specific kind of alcohol used is not strictly limited, but alcohols with 1 to 10 carbon atoms are preferred, because alcohols with 1 to 10 carbon atoms are in liquid state and can be used not only as reactants but also as reaction media during the reaction , to make the reaction milder, which is very beneficial for increasing the reaction rate and conversion rate of the esterification reaction. More preferred are monohydric alcohols having 1 to 10 carbon atoms, such as propanol, butanol, pentanol, hexanol, heptanol, octanol, nonanol, decanol, isopropa...

Embodiment 1

[0102] This embodiment provides a photocurable ink resistant to gold-plating potion, the photocurable ink includes the following components by weight:

[0103] Acrylic acid copolymer resin, 10 parts;

[0104] Esterified styrene-maleic anhydride copolymer resin, 10 parts;

[0105] Trimethylolpropane triacrylate, 14 parts;

[0106] 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone, 2 parts;

[0107] Talcum powder, 30 parts;

[0108] Propylene glycol methyl ether acetate, 30;

[0109] Phthalo blue, 2 parts;

[0110] Leveling agent, 1 part; defoamer, 1 part by weight.

[0111] The photocurable ink of this embodiment is obtained after mixing the above components uniformly in proportion.

[0112] Wherein, the acrylic acid copolymer resin is obtained by copolymerizing acrylic acid and methyl methacrylate, its weight average molecular weight is 100,000 (Mw), its molecular weight distribution index is 1.95, and its acid value is 150 mgKOH / g. Based on the total mass of acr...

Embodiment 2

[0137] This embodiment provides a photocurable ink resistant to gold-plating potion, the photocurable ink includes the following components by weight:

[0138] Methacrylic acid copolymer resin, 5 parts;

[0139] Esterified styrene-maleic anhydride copolymer resin, 25 parts;

[0140] Dipentaerythritol hexaacrylate, 5 parts;

[0141] Benzoin dimethyl ether, 6 parts; 2-isopropyl thioxanthone, 2 parts;

[0142] Silica, 5 parts;

[0143] Propylene glycol methyl ether acetate, 42 parts;

[0144] phthalo green, 5 parts;

[0145] Leveling agent, 1 part; adhesion promoter, 1 part; defoamer, 3 parts.

[0146] The photocurable ink of this embodiment is obtained after mixing the above components uniformly in proportion.

[0147] Among them, the methacrylic acid copolymer resin is obtained by copolymerizing methacrylic acid, methyl acrylate and cyclopentene, and has a weight average molecular weight of 10,000 (Mw), a molecular weight distribution index of 1.70, and an acid value of 5...

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Abstract

The invention discloses photo-cured printing ink for a gold-plating resistant potion and application of the photo-cured printing ink, belonging to the technical field of a printed circuit board. The photo-cured printing ink is prepared from the following components in parts by weight: 5 to 25 parts of (methyl) acrylic copolymer resin, 5 to 25 parts of esterified styrene-maleic anhydride copolymer resin, 5 to 25 parts of polymeric monomers, 0.5 to 8 parts of photoinitiator, 5 to 40 parts of fillers and 30 to 70 parts of solvent, wherein the (methyl) acrylic copolymer resin is obtained by means of copolymerizing ethylene-series unsaturated monomers and / or propylene-series unsaturated monomers with methyl acrylic acid. The photo-cured printing ink disclosed by the invention has the advantages that the effects of excellent resolution, excellent adhesive force, excellent hardness, excellent gold-plating potion resistance and excellent film stripping performance are achieved, and the photo-cured printing ink is suitably used for selectively covering a PCB (printed circuit board) in a PCB gold-plating technology, especially suitable for producing a high-precision PCB with a smaller welding spot pitch.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a photocurable ink resistant to gold plating solution and its application. Background technique [0002] Printed circuit board (PCB) is a provider of circuit connections for electronic components and is an important electronic component. In the process of making printed circuit boards, in order to ensure that the pads have good solderability, oxidation resistance and electrical conductivity, it is necessary to plate gold on the surface of the pads or lines. However, due to the high cost of gold plating, in the actual production process, it is usually only plated with gold on certain parts of the pads or lines. This requires covering the protective layer on the parts that do not need gold plating before gold plating, and then apply the protective layer after the gold plating is completed. layer removed. [0003] In order to ensure the smooth progress of the gold-p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/101C09D11/107
CPCC09D11/101C09D11/107
Inventor 汤进刘翘楚钟亮谢鑫陈曦
Owner SHANGHAI PHICHEM MATERIAL CO LTD
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