Method for cutting flexible display substrate motherboard, flexible display device, display device and laser cutting machine

Abstract

The invention provides a method for cutting a mother board of a flexible display substrate, a flexible display device, a display device and a laser cutting machine. The method comprises the steps that a laser is utilized for cutting the upper surface of the mother board of the flexible display substrate along the preset path, a metal lead is formed on the lower surface of the mother board of the flexible display substrate, the preset path intersects with at least one part of the metal lead, and the laser does not make contact with the metal lead; and physical force is utilized, and the mother board of the flexible display substrate is made to be fractured along the preset path. By utilization of the method, the laser does not make contact with the metal lead in the cutting process, and melting of the metal lead can be effectively avoided; meanwhile, scraps splashed to the metal lead can be obviously reduced, accordingly the short-circuit situation is effectively avoided, and the product yield is obviously improved.

Description

technical field [0001] The invention relates to the field of display technology and the field of laser cutting technology, in particular to a method for cutting a flexible display substrate motherboard, a flexible display device, a display device and a laser cutting machine. Background technique [0002] The flexible display device is a multi-layer film structure. The general device structure is TFT (thin film transistor), OLED (organic light emitting diode), BF (water oxygen barrier film) and other film layers. Usually, when the above process is completed, the flexible substrate needs to be Cutting is done with a laser. There are two mainstream laser cutting light sources, one is carbon dioxide laser and the other is UV laser. Usually the cutting of the film layer is realized by carbon dioxide laser, and the cutting of glass is realized by UV laser. [0003] When manufacturing a flexible display MDL (display module), it is necessary to cut a large-format substrate into a ...

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Problems solved by technology

[0007] During the research process, the inventor found that the problem of short circuit caused by the melting of the metal leads or the splashing of debris during the existing laser cutting of the flexible display substrate motherboard is due to the cutting from the front side of the metal leads, the laser line and the flying debris It can directly contact the metal lead. Based on this, the inventor proposes that if cutting is performed from the back of the metal lead, and by controlling the energy of the laser line, the laser just cuts the film layer and does not damage the metal lead. The different parts of the metal wire are separated, which can effectively avoid the contact between the laser and the metal wire, which will cause the metal wire to melt and affect the performance of the device, and cutting from the back of the metal wire can also greatly reduce the debris splashing on the metal wire and cause a short circuit.

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