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Heat conduction and gap filling material and preparation method thereof

A technology of interstitial material and composite material, applied in the field of thermal conductive interstitial material and its preparation, can solve the problems of poor thermal conductivity and difficult orientation, and achieve the effect of good thermal conductivity

Inactive Publication Date: 2017-07-04
JONES TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above-mentioned defects, the technical problem to be solved by the present invention is to provide a heat-conducting gap-filling material to solve the problem of poor thermal conductivity and difficult orientation of the heat-conducting gap-filling material existing in the current technology

Method used

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  • Heat conduction and gap filling material and preparation method thereof

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Effect test

Embodiment 1

[0030] First, take a thermosetting resin with a mass percentage of 1% and a molecular weight of 5,000 as the matrix, a graphene / carbon nanotube composite material with a mass percentage of 1% and a particle size of 10nm, and a mass percentage of 95% with a particle size of 0.1 μm Al2O3, the mass percent is 2% silane coupling agent and 1% isoparaffin solvent; secondly, it is stirred for 10min by means of planetary stirring, and the stirred mixture is calendered again, and finally Bake at a high temperature of 90° C. for 1 min to prepare a thermally conductive gap-filling material.

[0031] Samples of thermally conductive interstitial materials were randomly obtained, and the thermal conductivity (w / m K) test was performed on the samples. The test results are shown in Table 1.

Embodiment 2

[0033] First, take thermoplastic resin with a mass percentage of 20% and a molecular weight of 500,000 as the matrix, a graphene / carbon nanotube composite material with a mass percentage of 5% and a particle size of 100nm, and a mass percentage of 5% with a particle size of 0.5μm Magnesium oxide, 68% by mass, aluminum oxide with a particle size of 100 μm, 1% by mass of a mixture of silane coupling agent and aluminate coupling agent, and 1% by mass of a mixture of toluene and n-hexane Secondly, it was stirred for 120 minutes by means of ultrasonic stirring, and the stirred mixture was calendered again, and finally baked at a high temperature of 150° C. for 60 minutes to prepare a thermally conductive gap-filling material.

[0034] Samples of thermally conductive interstitial materials were randomly obtained, and the thermal conductivity (w / m K) test was performed on the samples. The test results are shown in Table 1.

Embodiment 3

[0036] Firstly, rubber with a mass percentage of 30% and a molecular weight of 15,000 was used as the matrix, a graphene / carbon nanotube composite material with a mass percentage of 10% and a particle size of 500nm, and a graphene / carbon nanotube composite material with a mass percentage of 59.9% and a particle size of 55 μm. Aluminum oxide, the mass percentage is 0.1% silane coupling agent; secondly, it is stirred for 100 minutes by means of planetary stirring, and after calendering, it is baked at a high temperature of 120 ° C for 25 minutes to prepare a thermally conductive gap filling material.

[0037] Samples of thermally conductive interstitial materials were randomly obtained, and the thermal conductivity (w / m K) test was performed on the samples. The test results are shown in Table 1.

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Abstract

The present invention provides a heat conduction and gap filling material, which comprises a mixture, wherein the mixture comprises, by mass, 1-30% of a matrix, 1-50% of a graphene / carbon nano-tube composite material, and 45-95% of a heat conduction ceramic powder. According to the present invention, the graphene / carbon nano-tube composite material has the high in-plane thermal conductivity of graphene, has the high axial (interfacial) thermal conductivity of carbon nano-tubes, is the excellent three-dimensional high thermal conductivity material, and can obtain the high thermal conductivity equivalent to the oriented anisotropic heat conduction fill by using the graphene / carbon nano-tube composite material as the heat conduction filler; by adding the graphene / carbon nano-tube composite material to the matrix, the excellent heat conduction performance can be obtained; by matching the graphene / carbon nano-tube composite material and the ceramic thermal powder, the excellent thermal conductivity can be obtained; and on the basis, the present invention further provides a preparation method of the heat conduction and gap filling material.

Description

technical field [0001] The invention relates to the technical field of heat conduction, in particular to a heat conduction gap filling material and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the scale of integrated circuits has become larger and larger, and electronic components have been integrated into electronic systems for a wide range of applications, including data processing, signal transmission, power supply systems, and so on. [0003] In order for these integrated blocks to operate correctly and stably, the heat generated by each electronic component must be effectively and reliably transferred away from the component. But in fact, the surface of heat transfer components is irregular, with a large number of tiny depressions and pores, which can accommodate air, and the thermal conductivity of air is very low, resulting in the heat generated cannot be effectively conducted to the radiator, Aff...

Claims

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Application Information

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IPC IPC(8): C08L101/00C08K13/04C08K3/04C08K7/24C08K3/22C08K5/54C08K5/10C09K5/14
CPCC08K3/04C08K3/22C08K5/10C08K5/54C08K7/24C08K13/04C08K2003/222C08K2003/2227C09K5/14C08L101/00C08L21/00
Inventor 刘羽中杨建曲媛媛
Owner JONES TECH