High-strength,high-thermal-conductivity and modified polyphenyl ether material and preparation method thereof

A polyphenylene ether, high thermal conductivity technology, applied in the field of polyphenylene ether materials and their preparation, can solve the problems of poor thermal conductivity, no thermal conductivity modification, and inability to meet electronic communication components, etc., to improve thermal conductivity, improve mechanical strength, The effect of solving the problem of blanking

Active Publication Date: 2017-07-07
SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the relatively poor thermal conductivity of the material itself and the lack of corresponding thermal conductivity modification in this patent, the product cannot meet the requirements of electronic communication components for high thermal conductivity

Method used

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  • High-strength,high-thermal-conductivity and modified polyphenyl ether material and preparation method thereof
  • High-strength,high-thermal-conductivity and modified polyphenyl ether material and preparation method thereof
  • High-strength,high-thermal-conductivity and modified polyphenyl ether material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] (1) Take each component raw material by the following parts by weight:

[0032]

[0033] (2) First add boron nitride and OP wax into the 100°C high-speed mixer, stir at high speed for 10 minutes, and then mix the remaining raw materials and the processed boron nitride through the high-speed mixer, and the speed of the high-mixer is 800-1000rmp , the mixing temperature is 40°C, and the mixture is mixed for 10 minutes; the mixed material is passed through a twin-screw extruder, and the temperature of each zone is controlled at 260-290°C, and the heat-conducting modified material can be obtained by strand cutting.

[0034] (3) Take each component raw material by the following parts by weight:

[0035]

[0036] (4) Add the above materials except glass fiber into the high-speed mixer and mix at a high speed. Add it from the side feed port, control the temperature in each zone at 260-290°C, and cut the strands into pellets to obtain the reinforced modified material.

...

Embodiment 2

[0041] (1) Take each component raw material by the following parts by weight:

[0042]

[0043] (2) First add aluminum nitride and PE wax to a high-speed mixer at 130°C, and stir at a high speed for 20 minutes, then mix the remaining raw materials and processed aluminum nitride through a high-speed mixer, and the speed of the high-mixer is 800-1000rmp , the mixing temperature is 60°C, and the mixture is mixed for 3 minutes; the mixed material is passed through a twin-screw extruder, and the temperature of each zone is controlled at 245-270°C, and the heat-conducting modified material can be obtained by strand cutting into pellets.

[0044] (3) Take each component raw material by the following parts by weight:

[0045]

[0046] (4) Add the above materials except glass fiber into the high-speed mixer and mix at a high speed. Add it from the side feed port, control the temperature in each zone at 260-290°C, and cut the strands into pellets to obtain the reinforced modified...

Embodiment 3

[0051] (1) Take each component raw material by the following parts by weight:

[0052]

[0053] (2) First add silicon carbide and PETS to a high-speed mixer at 110°C and stir at a high speed for 5 minutes, then mix the remaining raw materials and processed silicon carbide at a high speed in a high-speed mixer. The speed of the high-mixer is 800-1000rmp, and the mixing temperature Mix for 5 minutes at 30°C; pass the mixed material through a twin-screw extruder, control the temperature of each zone at 260-280°C, and cut into pellets to obtain a thermally conductive modified material.

[0054] (3) Take each component raw material by the following parts by weight:

[0055]

[0056] (4) Add the above materials except glass fiber into the high-speed mixer for high-speed mixing. The high-speed mixer speed is 800-1000rmp, the mixing temperature is 60°C, and mix for 10 minutes; Add it from the side feed port, control the temperature in each zone at 250-280°C, and cut the strands i...

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Abstract

The invention relates to a high-strength, high-thermal-conductivity and modified polyphenyl ether material and a preparation method thereof. The polyphenyl ether material is formed by mixing an enhanced modified material and a thermal conductive modified material; the enhanced modified material is prepared from, by weight, 30-50 parts of polyphenyl ether, 5-15 parts of polystyrene, 40-60 parts of glass fibers, 0.3-0.6 part of lubricant and 0.2-0.5 part of antioxidant; the heat-conducting modified material is prepared from, by weight, 12-40 parts of polyphenyl ether, 10-25 parts of polystyrene, 3-8 parts of toughening agent, 40-70 parts of thermal conductive filler, 1-3 parts of lubricant and 0.2-0.5 part of antioxidant. The polyphenyl ether material is prepared by firstly preparing the enhanced modified material and the thermal conductive modified material respectively and then mixing the enhanced modified material and the thermal conductive modified material in batch according to a certain proportion. Compared with the prior art, the polyphenyl ether material has the advantages of being large in mechanical strength, excellent in thermal conductivity, good in processability and the like.

Description

technical field [0001] The invention relates to a polyphenylene ether material and a preparation method thereof, in particular to a modified polyphenylene ether material with high strength and high thermal conductivity and a preparation method thereof. Background technique [0002] With the continuous development of industrial production and science and technology, people have higher and higher requirements for the comprehensive performance of thermal conductive materials, and traditional metal materials can no longer meet the requirements of some special occasions. For example, the rapid accumulation and increase of heat generated by electronic equipment will cause the device to malfunction, so timely heat dissipation has become an important factor affecting its life. Therefore, it is urgent to develop thermally conductive insulating materials with high reliability and high heat dissipation performance to replace traditional materials. Thermally conductive polymer material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L25/06C08L53/02C08L23/06C08K13/04C08K7/14C08K3/38C08K5/134C08K5/526
CPCC08L71/12C08L2205/025C08L2205/03C08L2205/035C08L25/06C08L53/02C08L23/06C08K13/04C08K7/14C08K2003/385C08K5/134C08K5/526C08K2003/282C08K5/103C08K3/34
Inventor 杨桂生赵亚囡李兰杰
Owner SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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