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A kind of heat-conducting glue and preparation method thereof

A technology of thermally conductive adhesives and thermally conductive fillers, applied in adhesives, natural rubber adhesives, non-polymer adhesive additives, etc., can solve problems such as difficult thermal conductivity, poor adaptability to high heat dissipation environments, and rapid thermal resistance drop. Achieve high mechanical strength and tear resistance, reduce card bridging structure, and improve physical properties

Active Publication Date: 2018-11-30
LOVEPAC CONVERTING BEIJING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current thermal conductive adhesives generally have defects such as low thermal conductivity and poor physical properties, and poor adaptability to high heat dissipation environments
The thermal conductivity of double-sided adhesive tape without base material is greatly limited by the thermal conductive adhesive. It is difficult to improve the thermal conductivity through low-cost solutions, and the thermal resistance decreases rapidly with the increase of thickness.
Single-sided and double-sided adhesive tapes with base materials generally use PET film as the base material. In addition to being limited by the thermal conductive adhesive, it is also limited by the base material, which makes it difficult to meet the heat dissipation needs of electronic equipment.

Method used

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  • A kind of heat-conducting glue and preparation method thereof
  • A kind of heat-conducting glue and preparation method thereof
  • A kind of heat-conducting glue and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Raw materials: 100 parts of polyacrylate; 70 parts of sheet-shaped thermal conductive filler graphene; 40 parts of sheet-shaped thermal conductive filler graphite; 1 part of silane coupling agent; 1 part of bentonite; 0.5 parts of antioxidant; 5 parts of tackifier; 180 parts of solvent parts; curing agent 0.5 parts.

[0035] First, the sheet-shaped thermally conductive filler 30 is subjected to surface modification treatment. The modified sheet-shaped thermally conductive filler 30 is stirred and cast with other raw materials to form a thermally conductive adhesive casting sheet with a thickness of 5-150 μm. The magnetic field makes the sheet-shaped thermally conductive filler 30 magnetized and then deflected to the direction of the magnetic field, thereby forming a sheet-shaped thermally conductive filler perpendicular to the thermally conductive adhesive (this will be further described in detail below). The purpose of the surface modification of the sheet-shaped therm...

Embodiment 2

[0037] The method of this embodiment is the same as that of Example 1, except that: in this embodiment, 40 parts of sheet-shaped heat-conducting filler graphene; 50 parts of sheet-shaped heat-conducting filler graphite. The thermal conductivity of the thermally conductive adhesive material with high orientation and high thermal conductivity prepared in this embodiment is 22 W / (m·K).

Embodiment 3

[0039]The method of this embodiment is the same as that of Example 1, except that in this embodiment, 50 parts of sheet-shaped heat-conducting filler graphene; 40 parts of sheet-shaped heat-conducting filler boron nitride. The thermal conductivity of the thermally conductive adhesive material with high orientation and high thermal conductivity prepared in this embodiment is 20 W / (m·K).

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Abstract

The invention provides heat-conducting glue and a preparation method thereof. The heat-conducting glue is arranged between a heat source generator and a radiator and used for the heat-conducting connection of the heat source generator and the radiator. The heat-conducting glue is characterized in that the heat-conducting glue is of a flaky structure and provided with an upper surface and a lower surface which are parallel to each other, flaky heat-conducting filler is evenly distributed in the heat-conducting glue, and the flaky surface of the flaky heat-conducting filler is vertical to the upper surface and the lower surface. The heat-conducting glue has the advantages that the flaky heat-conducting filler in the heat-conducting glue is arranged in a highly oriented manner and the flaky heat-conducting filler is vertical to the flaky heat-conductive glue, so that the obtained heat-conducting glue is high in heat-conducting orientation, the heat-conducting loss of heat-conducting particles arranged in a disordered manner is avoided, the card bridging structure of the flaky heat-conducting filler is reduced, the heat-conducting coefficient in the vertical direction of the heat-conducting glue is increased, the heat-conducting particles arranged in the oriented manner can acquire high mechanical strength and tear strength in the vertical direction, and physical performance is increased evidently.

Description

technical field [0001] The invention relates to a heat-conducting glue with a heat-conducting function for heat dissipation devices and a preparation method thereof, which is suitable for conducting heat-conducting connection between various heat source generators and radiators through the heat-conducting glue. Background technique [0002] Heat conduction has always been an important process in the electronics industry, and the operating temperature of components is often an important basis for reliability. In particular, the assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature, so the heat dissipation problem has become a crucial consideration in the design of electronic products. All kinds of heat source generators and heat sinks are connected by thermally conductive adhesives, such as heat dissipation designs in semiconductor, power supply, white goods, LED and other industries. [0003] Th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J133/04C09J107/00C09J11/04C09J11/06
CPCC08K3/04C08K3/346C08K5/54C08K7/00C09J11/04C09J11/06C09J107/00C09J133/04
Inventor 郑艳红刘丽梅张天旭逯平张文娟任全占程文星邓毅
Owner LOVEPAC CONVERTING BEIJING