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Thermal conduction gasket and preparation method thereof

A heat-conducting gasket and heat source technology, applied in semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of pulverization of thermally conductive filler filling rate, damage to flexibility, and high production costs, and to improve thermal conductivity, The effect of high thermal conductivity orientation

Pending Publication Date: 2018-09-07
LOVEPAC CONVERTING BEIJING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, if the filling rate of thermally conductive fillers is increased, the flexibility may be damaged, or pulverization may occur due to the high filling rate of thermally conductive fillers. Therefore, increasing the filling rate of inorganic fillers is limited, and it is difficult to meet the heat dissipation requirements of electronic equipment. need
In addition, for the purpose of high thermal conductivity, there are practices such as filling high thermal conductivity carbon fibers and carbon nanotubes into the matrix and using strong magnetic field orientation. This is based on the anisotropy of thermal conductivity of carbon fibers and carbon nanotubes, but is affected by And carbon nanotubes and matrix compatibility, material viscosity, magnetic field strength, magnetic field uniformity and other influences make the orientation effect unsatisfactory. The thermal conductivity of carbon fiber and carbon nanotube oriented thermal pads is only It can reach 10W / (m K), and materials such as high thermal conductivity carbon fiber, carbon nanotube and magnetic field generator are very expensive, and the production cost is high

Method used

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  • Thermal conduction gasket and preparation method thereof

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preparation example Construction

[0023] As described in the background, in order to improve the thermal conductivity of the thermal pad, the present invention provides an improved structure of the thermal pad and its preparation method, such as figure 1 As shown, the present invention is used to be arranged between the heat source generator and the heat sink to carry out heat conduction connection through the heat conduction pad, the method comprises the following steps: (1) high molecular polymer, graphene, surface modifier , rheology modifier, antioxidant, flame retardant, solvent, etc. are mixed to obtain a casting material composition; And after curing, obtain highly oriented sheet-like graphene primary sheet 1 (the sheet-like graphene primary sheet 1 is such as 0.005-0.5mm thick), and described primary sheet 1 has an upper surface and a lower surface parallel to each other , the inside of the primary sheet is evenly distributed with sheet-like graphene 1a, and the sheet-like surface of the sheet-like gra...

Embodiment 1

[0033] Raw materials: batching according to parts by mass, 100 parts of acrylate copolymer resin; 50 parts of graphene; 0.05 part of silane coupling agent; 2 parts of silicon dioxide; 0.5 part of antioxidant 1010; 1 part of flame retardant antimony trioxide ; Solvent toluene: ethyl acetate = 1: 2 solution 300 parts.

[0034] First, the graphene is surface-modified with a silane coupling agent, and the modified graphene is stirred and mixed with other raw materials to obtain a cast material composition, and then the cast material composition is obtained by using a flat film scraping machine (or comma roll coating) to coat the cast material. Cast the film of the material composition to obtain a cast sheet with a certain thickness, and then put it in a dryer at 50-100°C to dry and solidify for 5-20 minutes to obtain a highly oriented 0.15mm thick graphene sheet A primary sheet, the primary sheet has an upper surface and a lower surface parallel to each other, and sheet-like graphen...

Embodiment 2

[0036] The method of the present embodiment is the same as that of the embodiment 1, the difference is: a highly oriented 0.1mm thick sheet-like graphene primary sheet is made, and the thermal conductivity of the thermally conductive gasket with high orientation and high thermal conductivity prepared in the present embodiment It is 21W / (m·K).

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Abstract

The invention provides a thermal conduction gasket and a preparation method thereof. The preparation method comprises: (1) mixing a high molecule polymer, graphene, a surface modifier, a rheology modifier, an antioxidant, a flame retardant, a solvent and the like to obtain a composition; (2) carrying out film forming and curing on the composition to obtain a highly-oriented sheet-like graphene primary sheet, wherein the sheet-like graphene is uniformly distributed inside the primary sheet, and the sheet-like surface of the sheet-like graphene is parallel to the upper surface and the lower surface of the primary sheet; (3) laminating the primary sheet in a mold, and carrying out heating and pressurizing to form a molded body having a multilayer structure; and (4) cutting the molded body having the multilayer structure along a direction perpendicular to the upper surface and the lower surface of the multilayer structure to form the thermal conduction gasket with a certain thickness. According to the present invention, the arrangement direction of the sheet-like graphene in the thermal conduction gasket is highly oriented, such that the obtained thermal conduction gasket has high thermal conductivity orientation, and the thermal conductivity of the thermal conduction gasket in the vertical direction is improved.

Description

technical field [0001] The invention relates to a heat conduction gasket with heat conduction function for heat dissipation devices and a preparation method thereof, which is suitable for heat conduction connection between various heat source generators and radiators through the heat conduction gasket. Background technique [0002] Heat conduction has always been an important process in the electronics industry, and the operating temperature of components is often an important basis for reliability. In particular, the assembly of microelectronics is becoming more and more intensive, and its working environment is rapidly changing to high temperature, so the heat dissipation problem has become a crucial consideration in the design of electronic products. In order to dissipate heat more effectively, all kinds of heat source generators are installed on the radiator with the help of thermal pads. As a thermally conductive gasket, a thermally conductive gasket in which a filler ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/08C08K13/06C08K3/04C08K7/00C08K3/36C08K3/22H01L23/373
CPCC08K3/04C08K3/2279C08K3/36C08K7/00C08K13/06C08K2201/003H01L23/3737C08L33/08
Inventor 郑艳红张天旭刘丽梅任全占张文娟程文星逯平邓毅
Owner LOVEPAC CONVERTING BEIJING