Preparation method of bonding alloy wire

Abstract

The invention discloses a preparation method of a bonding alloy wire. The preparation method comprises the following steps that: (1) 99.995% silver is purchased, and the 99.995% silver is made into a silver sheet; (2) intermediate alloy is made; (3) vertical melting is performed; (4) wire drawing is performed; (5) intermediate annealing is performed; (6) wire drawing is performed again; (7) annealing is performed; (8) winding is performed; and (9) vacuum packaging is performed. According to the preparation method of the invention, when wire drawing is performed to obtain a wire rod of 70 to 100 microns, and an intermediate annealing process is additionally adopted to eliminate stress, so that wire drawing is smoother, and wire fracture can be better avoided; after a finished wire is annealed, surface treatment is performed on the finished wire, and therefore, a bonding effect of self-diffusion of the bonding alloy wire can be effectively avoided, and the yield of the finished product can be improved; surface residues of the alloy wire can be effectively reduced, and the quality of the product is improved. According to the preparation method of the invention, an ultrasonic cleaning system is utilized to effectively clean lubricating fluid on the surface of the alloy wire, and therefore, surface residues on the surface of the alloy wire can be effectively reduced, and the quality of the product can be improved.

Description

technical field [0001] The invention relates to an alloy material, in particular to a method for preparing a bonding alloy wire. Background technique [0002] Bonding gold wire is an alloy wire used as a connecting wire in an integrated circuit. Its gold content ≥ 99.99%, high reliability, but the price of gold is high; bonding copper wire is also a kind of bonding wire with high reliability, but the disadvantage is that it is extremely easy to oxidize. [0003] With the rapid development of the semiconductor industry, there is an urgent need for a material that is less expensive and less oxidizable to replace. Through the research on silver and other materials, it is decided to use silver to replace gold. Silver has the same inertness as gold, and there is no such thing as copper. The same easy-to-oxidize characteristics, and at the same time, adding some trace elements makes silver have the characteristics of bonding, making the balls more round and easy to bond. [0004...

AI Technical Summary

Problems solved by technology

[0004] Moreover, in the production process, it is easy to produce a self-diffusion bonding effect between the bonding alloy wires at this time, and then produce a large number of broken wires.

At the same time, in the preparation process of bonded alloy wire, the viscosity of the lubricating liquid used in the coarse and medium drawing processes of wire drawing is relativ