Polyetheramide toughened epoxy resin

A technology of epoxy resin and polyether amide, which is applied in the field of epoxy resin toughening, can solve the problems of large internal stress, fatigue resistance, poor impact resistance, unfavorable application of epoxy resin, etc., and achieve the effect of improving impact strength

Inactive Publication Date: 2017-07-14
HUNAN NORMAL UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The cross-linked and cured epoxy resin has outstanding mechanical properties and chemical stability, but the high cross-linking density makes the internal stress very large, and shows shortcomings such as brittleness, fatigue resistance, and poor impact resistance in ter

Method used

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  • Polyetheramide toughened epoxy resin
  • Polyetheramide toughened epoxy resin
  • Polyetheramide toughened epoxy resin

Examples

Experimental program
Comparison scheme
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Example Embodiment

[0016] Example 1

[0017] use Mw=4100 Mn=1900 Polyetheramide compound curing agent DDM use, for epoxy resin E51 Toughening modification.

[0018] Polyetheramine-D400 was used to react with adipic acid at 160°C for 8h to prepare polyetheramide with a certain molecular weight. The reaction equation is as follows figure 1 It is characterized by infrared spectroscopy, gel permeation chromatography, end-group titration, viscosity method, and thermogravimetric analysis. The test results show that there are both C-O-C and C=O features in the infrared spectrum of polyetheramide. The absorption peak, and the polyetheramide Mw=4100 Mn=1900 obtained under this condition, the content of terminal amino group is 195mmol / kg, the content of terminal carboxyl group is 192mmol / kg, the relative viscosity is 1.32, and the weight loss temperature of 5% polyetheramide is 310℃, it can have good thermal stability under the temperature conditions of DDM curing epoxy resin E51.

[001...

Example Embodiment

[0024] Example 2

[0025] use Mw=8200 、 Mn=4000 Polyetheramide compound curing agent DDM use, for epoxy resin E51 Toughening modification.

[0026] Polyetheramine-D400 was reacted with adipic acid at 160 °C for 12 h to prepare polyetheramide, and it was characterized by infrared spectroscopy, gel permeation chromatography, end-group titration, viscosity method, and thermogravimetric analysis. The test results show that there are characteristic absorption peaks of C-O-C and C=O in the infrared spectrum of polyetheramide, and the polyetheramide prepared under this condition has Mw=8200, Mn=4000, and the content of terminal amino groups is 126mmol / kg. The carboxyl group content is 132 mmol / kg, the relative viscosity is 1.43, and the weight loss temperature of 5% polyetheramide is 321 ℃, which can have good thermal stability under the temperature conditions of DDM curing epoxy resin E51.

[0027] The polyetheramide prepared by reacting at 160°C for 12h was used ...

Example Embodiment

[0030] Example three

[0031] use Mw=30400 、 Mn=17300 Polyetheramide compound curing agent DDM use, for epoxy resin E51 Toughening modification.

[0032]Polyetheramine-D400 was reacted with adipic acid at 160°C for 48 hours to prepare polyetheramide, and it was characterized by infrared spectroscopy, gel permeation chromatography, end group titration, viscosity method, and thermogravimetric analysis. The test results show that there are characteristic absorption peaks of C-O-C and C=O in the infrared spectrum of polyetheramide at the same time, and the polyetheramide prepared under this condition has Mw=30400, Mn=17300, the content of terminal amino group is 28mmol / kg, and the content of terminal amino group is 28mmol / kg. The carboxyl content is 30mmol / kg, the relative viscosity is 1.57, and the weight loss temperature of 5% polyetheramide is 347°C. It can have good thermal stability under the temperature conditions of DDM curing epoxy resin E51.

[0033] Th...

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Abstract

The present invention provides a polyetheramide-containing epoxy resin composition and a preparation method thereof, and relates to the technical field of epoxy resin toughening modification. The epoxy resin composition comprises an epoxy resin, polyetheramide, a curing agent, a promoter, and a solvent or a diluent, wherein amino-terminated polyether and a dibasic acid are polymerized at a high temperature to obtain the polyetheramide, and a ratio of the total mass of the polyetheramide to the total mass of the epoxy resin is (1-90):100. According to the present invention, the impact strength of the epoxy resin composition containing different molecular weights or different contents of the polyetheramide can be remarkably improved after the curing, and optimally the improving can achieve more than 500%; and by rationally adjusting the ratio of the polyetheramide to the epoxy resin, the toughness of the epoxy resin can be well improved while the strength of the resin can be ensured so as to broaden the application field of the epoxy resin.

Description

technical field [0001] The invention belongs to the field of epoxy resin toughening. Specifically, polyetheramide can be used as a toughening agent to be added to the epoxy resin curing system to improve the toughness of epoxy resin. While maintaining the impact strength of the epoxy resin, the strength of the epoxy resin is better maintained. Background technique [0002] The epoxy resin after cross-linking and curing has outstanding mechanical properties and chemical stability, but the high cross-linking density makes the internal stress very large, and it shows shortcomings such as brittleness, fatigue resistance and poor impact resistance in performance. It is not conducive to the wider application of epoxy resin in production and life. Therefore, how to improve the toughness of epoxy resin while keeping other properties basically unchanged has attracted extensive attention of domestic and foreign researchers. [0003] A large number of epoxy resin toughening modificati...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L77/06
CPCC08L63/00C08L77/06
Inventor 易春旺任茜彭舒敏罗玉航
Owner HUNAN NORMAL UNIVERSITY
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