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Apparatus and method for plasma dicing

A plasma and equipment technology, applied in the field of ion cutting, which can solve problems such as overheating of the carrier tape

Active Publication Date: 2017-07-14
SPTS TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Carrier tapes are especially at risk of overheating

Method used

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  • Apparatus and method for plasma dicing
  • Apparatus and method for plasma dicing
  • Apparatus and method for plasma dicing

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Embodiment Construction

[0047] The first embodiment of the present invention is shown in figure 1 middle. The semiconductor substrate 11 includes scribe lines 12 and discrete semiconductor chips 13 . The semiconductor substrate 11 is generally composed of silicon, however, gallium arsenide and other Group III-V semiconductors may be used. A semiconductor substrate 11 is adhered to a dicing tape 14 which is positioned on top of an electrostatic chuck 15 . The ring frame 16 is positioned on top of the cutting belt 14 such that the cutting belt 14 is fixed between the ring frame 16 and the electrostatic chuck 15 . The semiconductor substrate 11 is designed to accommodate a certain degree of non-concentricity, typically ±3 mm, in the positioning of the ring frame 16 . The frame assembly 17 includes the semiconductor substrate 11 , the dicing tape 14 and the ring frame 16 . Dicing tape 14 is typically composed of polyolefin, poly(vinyl chloride) or poly(ethylene terephthalate). Ring frame 16 is typi...

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PUM

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Abstract

According to the invention there is provided an apparatus and a method for plasma dicing a semiconductor substrate of the type forming part of a workpiece, the workpiece further comprising a carrier sheet on a frame member, wherein the carrier sheet carries the semiconductor substrate. The apparatus comprises: a chamber; a plasma production device configured to produce a plasma within the chamber suitable for dicing the semiconductor substrate; a workpiece support located in the chamber for supporting the workpiece through contact with the carrier sheet; a frame cover element configured to, in use, contact the frame member thereby clamping the carrier sheet against an auxiliary element disposed in the chamber

Description

technical field [0001] The invention relates to an apparatus for plasma cutting a semiconductor substrate of the type forming part of a workpiece, the workpiece further comprising a carrier sheet on a frame member, wherein the carrier sheet carries the semiconductor substrate. The invention also relates to a related method of plasma cutting. Background technique [0002] Semiconductor manufacturing typically involves a large number of silicon chips processed in parallel on a single semiconductor wafer. Once the processing steps are complete, the wafer must be diced into discrete chips. The chip is then connected, followed by packaging. Traditionally, the singulation step is performed using a diamond saw along scribe lines on the wafer. Recently, there has been much interest in providing new methods of dicing wafers. These can enhance performance and reduce costs. One such method is to use a laser to perform dicing of the wafer. An alternative is to use plasma etching t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H01L21/683H01L21/67H01L21/78
CPCH01J37/32477H01J37/32522H01J37/32651H01J37/32724H01L21/67069H01L21/6831H01L21/78H01L21/67092H01J37/32715H01J37/32623H01L21/6836H01L2221/68327H01L21/02315H01L21/3065H05H1/46H01L21/68735H01L21/68721H01L21/68785H01L21/68778
Inventor 戈塔姆·拉格纳萨戴维·A·托塞尔奥立佛·安塞尔
Owner SPTS TECH LTD