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Heat-resistant polyurethane (PU) adhesive

A technology of heat resistance and raw materials, which is applied in the direction of adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problems of poor heat resistance and limited application, and achieve improved heat resistance, stable performance, and maintenance The effect of stability

Inactive Publication Date: 2017-07-25
陈建发
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a heat-resistant PU adhesive to overcome the problems of poor heat resistance and limited application of most existing PU adhesives

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0019] The raw materials for the preparation of the PU glue of the present embodiment consist of the following components in parts by weight: 600 parts of polyol, 750 parts of toluene, 25 parts of isocyanate, 15 parts of monoethanolamine, 3 parts of trimer, 150 parts of butanone, methyl 20 parts of ether, 780 parts of ethyl ester, 300 parts of acetone, 1200 parts of dimethyl ester, 23 parts of gaseous silica and 300 parts of refined methyl ester. The heat resistance of the PU glue prepared from the formula of this embodiment is between 125°C and 135°C.

Embodiment approach 2

[0021] The raw materials for the preparation of the PU glue of the present embodiment consist of the following components in parts by weight: 590 parts of polyols, 770 parts of toluene, 23 parts of isocyanates, 13 parts of monoethanolamine, 3 parts of trimers, 144 parts of butanone, methyl 22 parts of ether, 775 parts of ethyl ester, 280 parts of acetone, 1185 parts of dimethyl ester, 22 parts of gaseous silica and 310 parts of refined methyl ester. The heat resistance of the PU glue prepared by the formula of this embodiment is between 120°C and 130°C.

Embodiment approach 3

[0023] The raw materials for the preparation of the PU glue of the present embodiment consist of the following components in parts by weight: 580 parts of polyols, 780 parts of toluene, 28 parts of isocyanate, 18 parts of monoethanolamine, 4 parts of trimers, 160 parts of butanone, methyl 17 parts of ether, 790 parts of ethyl ester, 310 parts of acetone, 1220 parts of dimethyl ester, 24 parts of gaseous silica and 320 parts of refined methyl ester. The heat resistance of the PU glue prepared by the formula of this embodiment is between 123°C and 134°C.

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PUM

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Abstract

The invention relates to heat-resistant polyurethane (PU) adhesive. The PU adhesive is prepared from the following raw material components in parts by weight: 580-620 parts of polyol, 720-780 parts of toluene, 22-28 parts of isocyanate, 13-18 parts of monoethanolamine, 2-4 parts of a trimer, 140-160 parts of butanone, 17-22 parts of methyl ether, 770-790 parts of ethyl ester, 270-310 parts of acetone, 1180-1220 parts of dimethyl ester, 21-24 parts of fumed silica and 290-320 parts of fine methyl ester. The heat resistance of the PU adhesive prepared according to the formula provided by the invention is within a range of 120-145 DEG C, and is improved by about 70% compared with that of the conventional PU adhesive; the heat resistance of the PU adhesive is effectively improved, so that the PU adhesive can meet the use requirements of more industries; furthermore, the performance of the product is more stable; when being heated, the cured heat-resistant PU adhesive is not prone to have the phenomena of glue failure and glue overflow, so that the use stability of the PU adhesive product is better maintained.

Description

technical field [0001] The invention relates to an adhesive, in particular to a heat-resistant PU adhesive. Background technique [0002] PU adhesives are widely used in packaging, construction, shoemaking, furniture, machinery manufacturing and many other fields due to their advantages of environmental protection and high performance. However, the heat resistance of most PU adhesives currently on the market is between 70 and 85 °C, but such heat resistance cannot meet the needs of many fields. In high temperature environments (such as shipping containers), PU adhesives Gluing is easy to occur at the bonding place, which makes the product structure easy to change and cannot meet customer needs, resulting in a high return rate of the product, which in turn leads to great restrictions on the application of PU adhesives. Contents of the invention [0003] The invention provides a heat-resistant PU adhesive to overcome the problems of poor heat resistance and limited applicat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/04
CPCC09J175/04C08K3/36C09J11/04
Inventor 陈建发
Owner 陈建发
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