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Mems gyroscope chip wafer level testing system and testing and screening method

A test system, wafer-level technology, applied in microstructure devices, sorting, microstructure technology, etc., can solve the problems of low measurement accuracy, long test time, unsuitable for batch testing of production lines, etc., to save packaging costs, accurate The effect of effective testing

Active Publication Date: 2018-06-08
北京中科微知识产权服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the laser Doppler vibrometer method can only realize the vibration test in the vertical direction, and the strobe technology of the in-plane test requires a large number of image shooting and comparison processes, the test time is long and the measurement accuracy is low, which is not suitable for mass testing on the production line

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  • Mems gyroscope chip wafer level testing system and testing and screening method
  • Mems gyroscope chip wafer level testing system and testing and screening method

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Embodiment Construction

[0033] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0034] According to attached figure 1 Said, in order to be able to realize the fast and effective test of MEMS gyroscope wafer-level chip, the present invention has designed MEMS gyroscope chip wafer-level test system, it is characterized in that: comprise control host computer 1 and be used to place the carrier sheet of wafer 6 to be tested Platform 5, a program-controlled motor 16 is provided below the slide table 5, and the program-controlled motor 16 is connected to the control host 1 through the probe station controller 2; a probe card is fixed directly above the slide table 5 with a clamp 7. The probe card 7 is connected to the electrode of the wafer 6 to be tested on the slide table 5 through the probe 8; the probe card 7 is provided with an RS485 interface 13, a BNC triaxial interface 14 and a BNC coaxial interface 15. The probe card 7 is connected to ...

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PUM

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Abstract

The invention discloses a MEMS (Micro Electro Mechanical System) gyroscope chip wafer-level testing system and a testing and screening method. The MEMS gyroscope chip wafer-level testing system comprises a control host and a wafer carrying table for placing a wafer to be tested; a program control motor is arranged below the wafer carrying table; the program control motor is connected with the control host by a probe station controller; a probe card is fixed right above the wafer carrying table; the probe card is connected with an electrode of the wafer to be tested by a probe; the probe card is respectively connected with the control host, a high-accuracy source table and a network analyzer; both the high-accuracy source table and the network analyzer are connected with the control host; and on the probe card, a MCU (Micro Controller Unit) is respectively and electrically connected with an integrated circuit switching matrix, a C / V conversion chip and a C / V conversion circuit module. According to the MEMS gyroscope chip wafer-level testing system and the testing and screening method which are disclosed by the invention, by utilizing the control host, control on the probe card, the probe station controller, the high-accuracy source table and the network analyzer is implemented, so that parameter testing and testing result determination of a gyroscope chip are implemented, and an unqualified chip is screened out and removed, and thus, a case that the unqualified chip flows into the next packaging process is effectively avoided, and packaging cost is greatly saved.

Description

technical field [0001] The invention relates to a chip testing system and a fast testing and screening method, in particular to a fast and accurate wafer-level batch testing and screening method for MEMS gyroscope chips, which belongs to the technical field of micro-electromechanical system (MEMS) sensor testing. Background technique [0002] The traditional gyroscope is a rotating gyroscope made by machining, which uses the principle of conservation of angular momentum of a high-speed rotating object to measure the angular velocity. This gyroscope has high precision, but its structure is complicated, its cost is high, and its service life is greatly shortened by the wear and tear of high-speed rotating parts. The traditional gyroscope mainly uses the principle of conservation of angular momentum, so it is mainly a constantly rotating object, and the direction of its rotation axis does not change with the rotation of the bracket carrying it. Due to its small size, light wei...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C99/00B07C5/344
CPCB07C5/344B81C99/004B81C99/005
Inventor 马晶晶欧文莫宏波霍慧清
Owner 北京中科微知识产权服务有限公司
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