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A Microchannel Cooling System Driven by Bubble Micropump

A heat dissipation system and micro-channel technology, applied in the direction of electrical components, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems that the fan cooling system takes up a lot of space, cannot be used in small electronic equipment, and takes up a lot of space. The effect of simple structure, small loss and stable structure

Active Publication Date: 2019-07-26
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the miniaturization of electronic equipment has brought new challenges to the heat dissipation system of chips: the traditional fan cooling system cannot be applied to small electronic equipment such as mobile phones because it takes up too much space
Although traditional water-cooling equipment has a good cooling effect, it takes up a lot of space, the water pump is noisy, and it consumes a lot of energy.
The heat dissipation copper pipes commonly used on mobile phones also need to occupy additional space

Method used

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  • A Microchannel Cooling System Driven by Bubble Micropump
  • A Microchannel Cooling System Driven by Bubble Micropump

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Such as figure 1 As shown, a microchannel heat dissipation system driven by a microbubble pump includes a chip base 1, and the chip base 1 is processed with a microchannel circulation heat dissipation pipeline system; the microchannel circulation heat dissipation pipeline system includes a 1 The heat dissipation assembly 2 on the upper layer, the heat absorption assembly 3 and the microbubble pump assembly 4 all located in the inner layer of the chip substrate 1, and the heat dissipation assembly 2, the heat absorption assembly 3, and the microbubble pump assembly 4 into three The trunk pipe 5 that is connected in series to form a cycle;

[0024] The microbubble pump assembly 4 includes a phase change chamber 5, a one-way split chamber 6, an A buffer chamber 7 located upstream of the one-way split chamber 6, and a B buffer chamber 8 located downstream of the one-way split chamber 6; 3 and the phase change chamber 6 are located in the heat generating area of ​​the chip ...

Embodiment 2

[0029] Such as figure 2 , the difference between this embodiment and Embodiment 1 is that: A buffer chamber 8 and B buffer chamber 9 are composed of a plurality of capillary channels 13 connected in parallel or in series; the ends of the capillary channels 13 communicate with the outside world; Two one-way valves 15 in the same direction are connected in series at both ends of the distribution cavity tube 16;

[0030] A buffer chamber 8 and B buffer chamber 9 carry pressure fluctuations in the main pipe 5 through the compressibility of the buffer gas 19, and keep absolutely sealed with the outside world, and the inside and outside of the main pipe 5 are kept isolated, and the external interference is small. A buffer chamber 8 and B buffer chamber 9 are formed by a capillary flow channel 13, which generates flow resistance of the cooling liquid 11 through the alienation between the capillary tube 13 and the material of the cooling liquid 11, and is used to carry pressure fluct...

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Abstract

The invention discloses a micro-flow-channel heat dissipation system driven by a bubble micro-pump, and relates to the technical field of chip heat dissipation devices. The system comprises a chip base body, and the chip base body is provided with a micro-flow-channel circulating heat dissipation pipe system. The micro-flow-channel circulating heat dissipation pipe system comprises a heat dissipation assembly located at the upper layer of the chip base body, a heat absorption assembly located at an inner layer of the chip base body, a bubble micro-pump assembly located at the inner layer of the chip base body, and a trunk pipe which enables the heat dissipation assembly, the heat absorption assembly and the bubble micro-pump assembly to be connected in series. The bubble micro-pump is used for providing power, and a liquid cooling heat dissipation system can be integrated on a circuit board. The system achieves the heat dissipation function through the directional flowing of cooling liquid in a micro-flow channel. There is no need of an additional space. The temperature difference caused by the heat generated by a chip serves as the energy source for the working of the micro-pump, and no additional energy is consumed.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation devices, in particular to a heat dissipation system in which fluid is driven by an air bubble micropump in a microchannel to dissipate heat. Background technique [0002] At present, the miniaturization of electronic equipment has brought new challenges to the heat dissipation system of chips: the traditional fan cooling system cannot be applied to small electronic equipment such as mobile phones because it takes up too much space. Although the traditional water-cooling equipment has good cooling effect, it takes up a lot of space, the water pump is noisy, and consumes a lot of energy. The heat dissipation copper pipes commonly used on mobile phones also need to occupy additional space. [0003] Chip heat dissipation is an important adjustment faced by electronic equipment at present, and it is a bottleneck to improve the performance of electronic equipment such as computers and mob...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/427
Inventor 周俊杰屈扬苑士华胡纪滨吴维
Owner BEIJING INSTITUTE OF TECHNOLOGYGY