Method for preventing PCB solder mask oil leakage

A solder mask and oil printing technology, which is applied to non-printed masks, circuit covers, and the formation of electrical connections of printed components, can solve the problems of high cost of exposure machines, oil leakage, and repeated oil leakage, so as to reduce the scrap rate and ensure The effect of developing and improving quality

Inactive Publication Date: 2017-08-15
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the process control and raw material control by the above three methods have improved the oil leakage after the alignment development, i

Method used

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  • Method for preventing PCB solder mask oil leakage
  • Method for preventing PCB solder mask oil leakage

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0029] Example 1

[0030] A method for improving the oil emission of PCB solder resist, which is used to significantly improve the oil emission of the single-side window position after PCB registration development, including the following steps:

[0031] (1) Ink preparation

[0032] Add 10mL plug hole diluent to 1kg plug hole oil and mix well; add 40mL face oil diluent to 1kg face oil and mix well.

[0033] (2) Surface treatment

[0034] The board enters the solder mask process to brush the board, the current of the A line is 2.2A, and the speed is 2.5m / min, and the current of the B line is 3.4A, and the speed is 2.5m / min for control.

[0035] (3) Plug hole and stamp oil.

[0036] Perform plugging first, and then the entire board for ink printing. The plugging oil is plugged from the opposite side of the oil-emitting surface. The plugging and printing processes are divided into 10 steps.

[0037] (4) Pre-baking

[0038] The PCB board is pre-baked, and the parameters of the pre-baking are co...

Example Embodiment

[0049] Example 2

[0050] A method for improving the oil emission of PCB solder resist, which is used to significantly improve the oil emission of the single-side window position after PCB registration development, including the following steps:

[0051] (1) Ink preparation

[0052] Add 20mL plug hole diluent to 1kg plug hole oil and mix well; add 30mL face oil diluent to 1kg face oil and mix well.

[0053] (2) Surface treatment

[0054] The board enters the solder mask process to brush the board, the A wire brush current is 2A, the speed is 2m / min, and the B wire brush current is 3A, and the speed is 2m / min for control.

[0055] (3) Plug hole and stamp oil

[0056] First, plug the hole, and then perform the ink printing on the entire board. The plug hole oil is plugged from the opposite side of the oil-emitting surface. The plugging and ink printing process is divided into 8 steps.

[0057] (4) Pre-baking

[0058] The PCB board is pre-baked, and the parameters of the pre-baking are control...

Example Embodiment

[0069] Example 3

[0070] A method for improving the oil emission of PCB solder resist, which is used to significantly improve the oil emission of the single-side window position after PCB registration development, including the following steps:

[0071] (1) Ink preparation

[0072] Add 15mL plug hole diluent to 1kg plug hole oil and mix well; add 50mL face oil diluent to 1kg face oil and mix well.

[0073] (2) Surface treatment

[0074] The board enters the solder mask process to brush the board, the current of the A line is 2.5A, and the speed is 3m / min, and the current of the B line is 3.6A, and the speed is 3m / min for control.

[0075] (3) Plug hole and stamp oil

[0076] Firstly, plug the hole, and then perform the whole board printing. The plugging oil is plugged from the opposite side of the oil-emitting surface. The plugging and printing process are divided into two.

[0077] (4) Pre-baking

[0078] The PCB board is pre-baked, and the parameters of the pre-baking are controlled as f...

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Abstract

The invention provides a method for preventing PCB solder mask oil leakage. The method comprises the steps of: oil preparing, board surface processing, hole plugging and oil printing, pre-baking, film manufacturing, aligning/exposure, board punching and developing, UV curing and subsequent procedure conducting, wherein a green oil ring is additionally arranged on the periphery of a film single-side windowed region hole in the film manufacturing step, and a difference value between the diameter of the green oil ring and the diameter of the hole ranges from 2 to 5 mil. The method for preventing PCB solder mask oil leakage significantly prevents the oil leakage abnormal phenomenon at a single-side windowed position after aligning and developing, the appearance quality of the oil covering circuits and a substrate is good, and the adverse effect of plug hole oil leakage on the subsequent PCB production process is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular, the invention relates to a method for improving PCB anti-soldering oil emission. Background technique [0002] In the production process of printed circuit boards, after the outer circuit is produced, the surface circuit and the via holes must be protected against soldering and plugged to avoid oxidation of the outer circuit or short circuit during soldering and hole built-in after development. Keep the potion. In the existing PCB production process, some special structures such as circuit boards with windows on one side are prone to oil leakage after solder resist alignment development, and solder resist ink overflows to the copper surface with windows on one side due to oil leakage. , which is not allowed for customers who have strict requirements on product appearance. Nowadays, the PCB industry has more and more strict requirements on the appearance o...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/28H05K3/40
CPCH05K3/0073H05K3/0094H05K3/287H05K3/40H05K2201/0959H05K2203/0557
Inventor 冯佳骥刘德林刘德威
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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