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Method for preventing PCB solder mask oil leakage

A solder mask and oil printing technology, which is applied to non-printed masks, circuit covers, and the formation of electrical connections of printed components, can solve the problems of high cost of exposure machines, oil leakage, and repeated oil leakage, so as to reduce the scrap rate and ensure The effect of developing and improving quality

Inactive Publication Date: 2017-08-15
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the process control and raw material control by the above three methods have improved the oil leakage after the alignment development, it is still prone to oil leakage in the later stage, and even repeated oil leakage, and the cost of using an advanced exposure machine is also high

Method used

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  • Method for preventing PCB solder mask oil leakage
  • Method for preventing PCB solder mask oil leakage

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A method for improving PCB anti-soldering oil emission, which is used to significantly improve oil emission at the position of opening a window on one side after PCB alignment development, comprising the following steps:

[0031] (1) Ink preparation

[0032] Add 10mL plug thinner to 1kg plug oil and mix well; add 40mL top oil thinner to 1kg top oil and mix well.

[0033] (2) Surface treatment

[0034] The board enters the anti-soldering process to brush the board. The current of the A-line brushing board is 2.2A, and the speed is 2.5m / min, and the B-line brushing current is 3.4A, and the speed is 2.5m / min for control.

[0035] (3) Plug holes and ink.

[0036] Plug the hole first, and then print the entire board, and plug the hole oil from the opposite side of the oil emitting surface. The plugging and ink printing process is carried out in 10 steps.

[0037] (4) Pre-baked

[0038] The PCB board is pre-baked, and the parameters of the pre-baking are controlled as fol...

Embodiment 2

[0050] A method for improving PCB anti-soldering oil emission, which is used to significantly improve oil emission at the position of opening a window on one side after PCB alignment development, comprising the following steps:

[0051] (1) Ink preparation

[0052] Add 20mL plug thinner to 1kg plug oil and mix well; add 30mL top oil thinner to 1kg top oil and mix well.

[0053] (2) Surface treatment

[0054] The board enters the anti-soldering process to brush the board. The current of the A-line brushing board is 2A, and the speed is 2m / min. The current of the B-line brushing board is 3A, and the speed is 2m / min for control.

[0055] (3) Plug hole and ink

[0056] Plug the hole first, and then print the entire board, and plug the hole oil from the opposite side of the oil emitting surface. The plugging and ink printing process is carried out in 8 steps.

[0057] (4) Pre-baked

[0058] The PCB board is pre-baked, and the parameters of the pre-baked are controlled as follow...

Embodiment 3

[0070] A method for improving PCB anti-soldering oil emission, which is used to significantly improve oil emission at the position of opening a window on one side after PCB alignment development, comprising the following steps:

[0071] (1) Ink preparation

[0072] Add 15mL plug hole diluent to 1kg plug hole oil and mix well; add 50mL top oil thinner to 1kg top oil and mix well.

[0073] (2) Surface treatment

[0074] The board enters the anti-soldering process to brush the board. The brushing current of the A line is 2.5A and the speed is 3m / min, and the current of the B line brushing board is 3.6A and the speed is 3m / min for control.

[0075] (3) Plug hole and ink

[0076] Plug the hole first, and then print the entire board, and plug the hole oil from the opposite side of the oil emitting surface. The plugging and ink printing process is carried out in two steps.

[0077] (4) Pre-baked

[0078] The PCB board is pre-baked, and the parameters of the pre-baking are control...

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PUM

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Abstract

The invention provides a method for preventing PCB solder mask oil leakage. The method comprises the steps of: oil preparing, board surface processing, hole plugging and oil printing, pre-baking, film manufacturing, aligning / exposure, board punching and developing, UV curing and subsequent procedure conducting, wherein a green oil ring is additionally arranged on the periphery of a film single-side windowed region hole in the film manufacturing step, and a difference value between the diameter of the green oil ring and the diameter of the hole ranges from 2 to 5 mil. The method for preventing PCB solder mask oil leakage significantly prevents the oil leakage abnormal phenomenon at a single-side windowed position after aligning and developing, the appearance quality of the oil covering circuits and a substrate is good, and the adverse effect of plug hole oil leakage on the subsequent PCB production process is avoided.

Description

technical field [0001] The invention relates to the technical field of printed circuit board processing, in particular, the invention relates to a method for improving PCB anti-soldering oil emission. Background technique [0002] In the production process of printed circuit boards, after the outer circuit is produced, the surface circuit and the via holes must be protected against soldering and plugged to avoid oxidation of the outer circuit or short circuit during soldering and hole built-in after development. Keep the potion. In the existing PCB production process, some special structures such as circuit boards with windows on one side are prone to oil leakage after solder resist alignment development, and solder resist ink overflows to the copper surface with windows on one side due to oil leakage. , which is not allowed for customers who have strict requirements on product appearance. Nowadays, the PCB industry has more and more strict requirements on the appearance o...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/28H05K3/40
CPCH05K3/0073H05K3/0094H05K3/287H05K3/40H05K2201/0959H05K2203/0557
Inventor 冯佳骥刘德林刘德威
Owner HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
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