Triple-frame dual-mass silicon micromachined gyroscope with direct frequency output

Abstract

The invention discloses a direct frequency output three-frame type dual-mass silicon micromechanical gyroscope, which comprises a lower-layer glass substrate, a lead layer, a bonding layer and an upper silicon structure layer, wherein metal is sputtered on the upper surface of the lower-layer glass substrate to serve as the lead layer, the bonding layer covering the lead layer and the lower-layer glass substrate is arranged on the lower-layer glass substrate, the upper silicon structure layer is suspended above the lower-layer glass substrate through the bonding layer, and comprises two upper-layer silicon micromechanical substructures and coupling connecting beams, and the two upper-layer silicon micromechanical substructures are symmetric about the vertical central axis of a structure. According to the gyroscope, the influence of a common mode error of linear acceleration, temperature and the like can be effectively inhibited, structure decoupling can be better realized, an orthogonal error of the structure can be reduced, moreover, a detected displacement change is converted into a frequency change of a tuning fork resonator, and an output frequency signal is high in stability, is unlikely to be interfered by noise and is low in error rate in transmission and processing processes.

Description

technical field [0001] The invention relates to the technical field of micro-electromechanical systems (MEMS) and micro-inertial measurement, in particular to a three-frame double-mass silicon micro-mechanical gyroscope with direct frequency output. Background technique [0002] Since the 1980s, the development of micro-electromechanical systems and micro-manufacturing technology has promoted the development of micro-inertial technology and micro-inertial instruments, leading to the generation of a new generation of accelerometers and gyroscopes. Micro-inertial instruments are mostly manufactured by semiconductor processing technology, with small size, light weight and low power consumption. Using silicon as a processing material and using a processing technology compatible with the manufacturing process of microelectronic integrated circuits can integrate the sensitive meter and signal processing circuit of silicon micro inertial devices on one chip, thereby realizing mass ...

AI Technical Summary

Problems solved by technology

[0004] At present, MEMS gyroscopes generally adopt the capacitive detection method. Due to the micro-size effect of the structure, the sensitivity of the device is low, and the complex closed-loop circuit increases the difficulty of device design and processing, and is affected by the electro-mechanical coupling, and the signal-to-noise ratio is small.

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