Satellite-borne electronic equipment backboard

A technology for electronic equipment and backplanes, applied in the aerospace field, can solve the problems of low reliability, lack of backplane-level dual redundancy support, and high design risks, so as to reduce engineering risks and costs, and achieve rapid integration and application capabilities. , the effect of high reliability

Inactive Publication Date: 2017-08-18
10TH RES INST OF CETC
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  • Abstract
  • Description
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Problems solved by technology

[0004] The purpose of the present invention is to overcome the long design cycle of backplanes used in aerospace electronic systems in the prior art, which cannot be changed and expanded once designed, and lacks dual redundancy support at the backplane level, resulting in low reliability and design risks. The biggest disadvantage is to provide a scalable, dual-redundant backplane-level, high-reliability backplane for on-board electronic equipment

Method used

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  • Satellite-borne electronic equipment backboard
  • Satellite-borne electronic equipment backboard
  • Satellite-borne electronic equipment backboard

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Embodiment Construction

[0018] refer to figure 1 . In the embodiment described below, an onboard electronic equipment backplane includes: a data management module 2, a data exchange module 3, a power supply module 4, a high-speed backplane 5, an expansion backplane 6, a chassis transfer module 7 and an expansion Connector 8, data and signal exchange bus ①, management bus ②, power bus ③.

[0019] On the high-speed backplane 5, the two data management modules 2 are centered on the two data exchange modules 3, respectively arranged in parallel arrays on both sides of the two data exchange modules 3, and there are at least three parallel arrays on both sides of the two data exchange modules 3 The extended data and signal processing module 1 is extended to both ends; in the length direction of the expansion backplane 6, there are signal processing modules 1 in a parallel array with the same data as the number of the above-mentioned modules; the high-speed backplane 5 passes through 8 pairs of expansion c...

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Abstract

The invention aims at providing a satellite-borne electronic equipment backboard which has expansibility, a double-redundancy support backboard class and high reliability. The satellite-borne electronic equipment backboard is realized through the following technical scheme: on a high-speed backboard, two data management modules are respectively arrayed at two sides of two data exchange modules in parallel by taking the two data exchange modules as centers, and at least three data and signal processing modules which extend to two ends are arrayed at two sides of the two data exchange module in parallel; in the length direction of an extension backboard, data signal processing modules corresponding to above modules in the aspect of quantity are arrayed in parallel; the data and signal processing modules and the data management modules are interconnected to carry out communication between the high-speed backboard and the extension backboard through data provided by the data exchange modules, and the data management module acquires and monitors the health information and state information of each module so as to uniformly control the operation state and parameters of each module.

Description

technical field [0001] The invention relates to the field of aerospace technology, in particular to a backboard of electronic equipment mainly used in space. Background technique [0002] With the development of large aerospace vehicles, more stringent requirements are put forward for the integration, scalability and integration capabilities of on-board electronic systems. The backplane system of the traditional aerospace mission electronic system is designed in the mode of one satellite and one platform. Basically, all satellite backplane systems are customized. The bus design and module functions depend on different tasks. When a specific The task requires the replacement of a single satellite component. Due to the incompatibility of its physical interface, it cannot be quickly integrated and applied. It is necessary to redefine, design and produce the entire backplane system. And usually its backplane system is a single large independent backplane. Its defect is that onc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F11/16H04B7/185
CPCG06F11/1675H04B7/18519
Inventor 杨海峰
Owner 10TH RES INST OF CETC
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