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Micro light-emitting diode device and manufacturing method thereof

A technology of light-emitting diodes and manufacturing methods, which is applied to semiconductor devices, electrical solid devices, electrical components, etc., and can solve the problems of losing the adhesion of the stabilizing column and poor adhesion between the stabilizing column and the conductive contact of the device.

Active Publication Date: 2019-02-05
TIANJIN SANAN OPTOELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Chinese patent document CN105359283 discloses a micro-LED device with pillars, which uses a stabilizing post under the micro-device as a support for the micro-LED device, but the adhesion between the stabilizing post and the conductive contacts of the device is not very good , any mechanical movement or other external factors after the chip is fabricated and before it is picked up may cause the micro-device to lose its adhesion to the stabilizing post

Method used

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  • Micro light-emitting diode device and manufacturing method thereof
  • Micro light-emitting diode device and manufacturing method thereof
  • Micro light-emitting diode device and manufacturing method thereof

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Embodiment Construction

[0032] Various embodiments below disclose structures for securing arrays of micro devices, such as micro light-emitting diode (LED) devices on a carrier substrate, to be picked up and transferred to a receiving substrate. In one embodiment, the securing layer consists of an adhesive Formed from materials that hold the array of microdevices in place on the carrier substrate while also providing a structure from which the array of microdevices can be easily picked up. The adhesive material includes thermosetting materials such as, but not limited to, benzocyclobutene (BCB ) or epoxy resin.

[0033] The micro light-emitting diode device of the present invention will be described in detail below in conjunction with the manufacturing method and schematic diagrams.

[0034] (1) Provide an epitaxial structure 100 such as figure 1 As shown, an epitaxial structure 100 is provided, which may generally include a growth substrate 101 and epitaxial stacked layers thereon, including an N-t...

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Abstract

The invention discloses a micro light emitting diode device and a manufacturing method thereof. The micro light emitting diode device comprises: a micro device unit array with gaps between adjacent micro device units; a connection layer located between the micro device units The gap is connected to at least one micro-device unit; the fixed layer is located under the array of micro-device units, only in contact with the lower surface of the connection layer, and forms a cavity under the micro-device unit. The present invention aims at small-sized micro-semiconductor units, and forms a connection layer in the gap between them for contact with the fixed layer, which can greatly increase the contact area of ​​the bonding point and ensure that the micro-device will not be damaged due to the influence of external factors before being picked up. rate loss.

Description

technical field [0001] The invention relates to a micro light-emitting diode device and a manufacturing method thereof. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. Some examples of microdevices include microelectromechanical systems (MEMS) snap switches, light emitting diode display systems, and MEMS or quartz based oscillators. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] Chinese patent document CN105359283 discloses a micro-LED device with pillars, which uses a stabilizing post under the micro-device as a support for the micro-LED device, but the adhesion be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/00
CPCH01L25/0753H01L33/005H01L33/0095H01L33/62H01L33/0093H01L33/0075H01L33/20H01L2933/0066
Inventor 盛翠翠王笃祥钟秉宪吴俊毅吴超瑜
Owner TIANJIN SANAN OPTOELECTRONICS
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