A Passive Component Integrated Device of Interleaved Parallel Sepic Circuit
A technology of passive components and integrated devices, applied in the direction of electrical components, output power conversion devices, transformer/inductor components, etc., can solve the problems of low space utilization, power density reduction, and large number of components, etc., to achieve reduction Quantity and volume, improving space utilization, weakening the effect of parasitic oscillation
Active Publication Date: 2019-08-06
XIANGTAN UNIV
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Problems solved by technology
Usually these passive components are implemented with discrete components, not only the number of components is large, but also the shapes and sizes are different, and the space utilization rate is low. The use of discrete components greatly reduces the power density of power electronic equipment, and even the parasitic parameters of discrete components, such as The equivalent parallel capacitance of the inductor, the pin inductance of the capacitor, and the layout of the layout can also adversely affect the performance of the interleaved parallel Sepic circuit
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[0019] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
[0020] Such as Figure 1-Figure 3 As shown, it includes a first integrated winding 17, a second integrated winding 18, a first transformer integrated winding 15, a second transformer integrated winding 16, a first E-type magnetic core 1 and a second E-shaped magnetic core 2; the first The E-shaped magnetic core 1 is located above the second E-shaped magnetic core 2 and is opposite to the second E-shaped magnetic core 2; the first integrated winding 17 is wound on the center column of the first E-shaped magnetic core 1, and the second integrated winding 18 is wound on the center column of the second E-shaped magnetic core 2; the first transformer integrated winding 15 is wound on the left side column of the first E-shaped magnetic core 1 and the second E-shaped magnetic core 2; the second transformer integrated winding The winding 16 is wound on the rig...
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The invention discloses a passive component integration device of an interleaved parallel Sepic circuit. The device comprises two integrated windings, two transformer integrated windings and two E-type magnetic cores, the two E-type magnetic cores are arranged in an opposite manner, the two integrated windings respectively wind central columns of the two E-type magnetic cores, the two transformer integrated windings respectively wind edge columns at the left sides and the right sides of the two E-type magnetic cores, each of the two integrated windings comprises an internal copper foil winding, a dielectric layer, and an external copper foil winding arranged in sequence from the inside to the outside, and each of the two transformer integrated windings comprises an internal copper foil winding, a leakage inductance material layer, and an external copper foil winding arranged in sequence from the inside to the outside. According to the device, boost inductors, energy storage capacitors and transformers in the interleaved parallel Sepic circuit are integrated in one magnetic component, the number and the size of passive components are reduced, the power density of the interleaved parallel Sepic circuit is improved, and the influence of distribution parameters on the circuit performance is reduced.
Description
technical field [0001] The invention discloses a passive component integration device of interleaving and parallel Sepic circuits. Background technique [0002] The aggravation of the energy crisis and the severe situation of global warming have led to the vigorous promotion of new energy technologies. In new energy technologies, distributed energy units such as photovoltaic cells, fuel cells, batteries, and supercapacitors have been widely used. However, these energy units The voltage level is usually relatively low, and the voltage gain is usually increased by a DC power converter to realize the conversion of energy from low voltage to high voltage. [0003] The interleaved parallel Sepic circuit is mainly composed of input DC power supply, boost inductor, energy storage capacitor, inverter, transformer and rectified output. The interleaved parallel Sepic circuit can realize the conversion of energy from low-voltage direct current to high-voltage direct current, provide g...
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IPC IPC(8): H02M3/335H01F27/30H01F27/28
CPCH01F27/2847H01F27/306H01F2027/2857H02M3/33569
Inventor 邓成蒋启文沈松林
Owner XIANGTAN UNIV