PCB plasma treatment device

A plasma and processing device technology, applied in the field of plasma processing devices, can solve the problems of tediousness and low degree of automation, and achieve the effect of improving processing efficiency and increasing the degree of automation

Active Publication Date: 2017-08-22
深圳优普莱等离子体技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this plasma treatment method can be processed in batches, it needs to be manually placed and taken out before and after plasma treatment, which is very cumbersome and has a low degree of automation
In addition, this plasma treatment takes up to 30 minutes in total

Method used

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  • PCB plasma treatment device
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Embodiment Construction

[0019] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

Provided is a PCB plasma treatment device. The PCB plasma treatment device includes a process chamber and a transport rail, and the process chamber is used for providing a plasma processing site for printed circuit boards (PCB); a plasma source is arranged in the process chamber and used for conduct plasma processing on the printed circuit boards (PCB) in the process chamber; the transport rail penetrates through a process chamber body, is used for conveying the printed circuit boards (PCB) into the process chamber body through the inlet end of the process chamber body, and is used for conveying the printed circuit boards (PCB) in the process chamber body out of the process chamber body through the outlet end of the process chamber body. Compared with the prior art that the printed circuit boards (PCB) are manually placed in a centralized mode to be subjected to plasma treatment, by the adoption of the PCB plasma treatment device, streamlined operation can be achieved, and the efficiency of the plasma treatment is improved.

Description

technical field [0001] The invention relates to the field of PCB processing, in particular to a PCB plasma processing device. Background technique [0002] Printed circuit board (PCB) is an indispensable and important accessory in the electronic information industry. During PCB processing, plasma treatment is often required. Plasma treatment can activate the activity, and it is a convenient, efficient and high-quality method for desmearing and backside etching of printed circuit boards. The process of plasma treatment is to process the holes after drilling and before copper deposition. The common plasma treatment process is: drilling - plasma treatment - KMnO4 cleaning secondary treatment - electroless copper deposition. Plasma treatment can remove problems such as poor electrical bonding of the inner copper layer and insufficient etch-back caused by residues of slag and carbide residues in the hole, but the current process has incomplete removal, so additional KMnO4 syrup...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/26
CPCH05K3/0008H05K3/0055H05K3/26H05K2203/1545
Inventor 全峰邬钦崇邬明旭朱振龙
Owner 深圳优普莱等离子体技术有限公司
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