Packaging structure and preparation method thereof

Abstract

A packaging structure and preparation method thereof. The packaging structure includes a bearing piece whose surface is provided with a metal layer and an electronic component, a wrapping layer which warps the electronic component and a shielding layer arranged on the wrapping layer. The metal layer surrounds the electronic component and is exposed out of the wrapping layer, the shielding layer is in contact with the metal layer, so as to suppress electromagnetic interference, thereby preventing the electronic component from electromagnetic wave interference.

Description

technical field [0001] The invention relates to a package structure, in particular to a package structure for preventing electromagnetic wave interference and a manufacturing method thereof. Background technique [0002] With the vigorous development of the electronics industry, most of the electronic products are developing toward the goal of miniaturization and high speed, especially the development of the communication industry has made it widely integrated in various electronic products, such as mobile phones (Cell phone), Laptop, etc. However, the above-mentioned electronic products need to use high-frequency radio frequency chips, and the radio frequency chips may be adjacent to a digital integrated circuit, a digital signal processor (Digital Signal Processor, referred to as DSP) or a base frequency chip (BB, Base Band), causing electromagnetic waves Interference (Electromagnetic Interference, referred to as EMI) phenomenon, so it is necessary to carry out electromag...

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Problems solved by technology

[0005] However, in the existing semiconductor package 1, the mesh metal cover 13 needs to be manufactured, thus increasing the complexity of the manufacturing method, and the mesh metal cover 13 needs to be assembled on the carrier 10, thus increasing the difficulty of assembly.

[0006] In addition, when performing the packaging manufacturing method, the packaging material 14 needs to pass through the mesh of the metal cover 13 to cover the semiconductor chip 11, but when the packaging material 14 passes through the mesh of the metal cover 13, turbulent flow is likely to occur , leading to the generation of air bubbles, resulting in easy generation of voids (void) in the packaging material 14, and popcorn effect (popcorn) in the subsequent heating manufacturing method

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