Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Multi-MCU data interaction intelligent acquisition device and method

A technology of data interaction and intelligent collection, which is applied in the direction of instruments, computer control, simulators, etc., can solve the problems of data stability interference, low efficiency, and many interfaces, so as to ensure correctness, real-time performance, and simple connection Effect

Pending Publication Date: 2017-09-05
HUNAN LINENG TECH
View PDF11 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When multiple MCUs access the shared memory area, although the slave MCU will notify the master CPU with an interrupt when there is data, when there are multiple slave CPUs, critical resources cannot be read and written at the same time, and the process needs to involve spin locks or atomic locks The blocking waiting mechanism affects the real-time performance of data collection
Although there is no MCU intervention in the memory DMA transfer, the main CPU cannot monitor the DMA transfer status, which interferes with the stability of the data
The method of transmitting data through the serial port is simple to connect, but the interface occupies too much and is inefficient, so it is not suitable for the acquisition system of large data volume

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-MCU data interaction intelligent acquisition device and method
  • Multi-MCU data interaction intelligent acquisition device and method
  • Multi-MCU data interaction intelligent acquisition device and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] The present invention will be described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present invention. In addition, those skilled in the art can make corresponding combinations of features in the embodiments in this document and in different embodiments according to the descriptions in this document.

[0035]The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein, for example, can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "compr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a multi-MCU data interaction intelligent acquisition device and method. The device comprises a main MCU processing module, a slave MCU acquisition module and a bottom layer module, wherein the main MCU processing module is used for sending broadcast packets and conducting data interaction with the slave MCU acquisition module and an upper computer; the slave MCU acquisition module is used for acquiring data of intelligent equipment and feeding back a data packet to the main MCU processing module after caching the data; the bottom layer module comprises various kinds of intelligent acquisition equipment. According to the multi-MCU data interaction intelligent acquisition device, the acquisition module is responsible for collecting, primarily processing and packing the data of a sensor, the processing module is responsible for integrating the data of the acquisition module and further processing the data, and finally the face-to-face interaction function is achieved through the modules and the upper computer together. An IIC bus time-sharing transmission mode is used among the modules for interaction, serial ports and network interface resources of the collected data are not occupied, the situations that self-spinning waiting is caused by access of critical resources and the real-time performance of a system is affected are avoided, and the correctness of the data can be ensured.

Description

technical field [0001] The invention relates to the technical field of industrial control, in particular to a device and method for multi-MCU data interactive intelligent collection. Background technique [0002] Today, with the rapid development of the Internet of Things industry, more and more sensors and intelligent devices are used in computer rooms, agriculture and other fields; how to collect the parameters and status of these devices in a timely manner has become an important issue. For the collection of intelligent equipment, the form of serial port and network is mostly used, and the data transmission is carried out by modbus protocol or TCP / IP protocol. Therefore, collecting data will occupy a lot of interface resources of an MCU. If the core chip with a single network port resource is used for the network interaction of the underlying sensor, the network port of the sensor will no longer be able to communicate with the upper computer, and the PC will not be able ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/042
CPCG05B19/0423G05B2219/24215
Inventor 石雪倩陈金玲黎朝晖瞿仕波
Owner HUNAN LINENG TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products