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Manufacture method of array substrate

A fabrication method and array substrate technology, which are applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices, etc., can solve problems such as poor device performance and corrosion, and achieve low power consumption, improved device characteristics, and high resolution. rate effect

Inactive Publication Date: 2017-09-08
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since InGaZnO semiconductors are sensitive to most acidic etching solutions, they are easily corroded during wet etching, resulting in poor device performance.

Method used

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  • Manufacture method of array substrate

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Embodiment Construction

[0039] The technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0040] In addition, the following descriptions of the various embodiments refer to the attached drawings to illustrate specific embodiments in which the present invention can be implemented. The directional terms mentioned in the present invention, for example, "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., only is to refer to the direction of the attached drawings. Therefore, the direction terms used are for better and more clearly explaini...

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Abstract

The invention discloses a manufacture method of an array substrate. The manufacture method includes forming a grid electrode on a substrate; forming a grid electrode insulation layer on a side of the substrate facing the grid electrode, wherein the grid electrode covers the grid electrode; settling an indium gallium zinc tin oxide layer and an indium gallium zinc oxide layer on a side of the grid electrode insulation layer away from the grid electrode; patterning the indium gallium zinc tin oxide layer and the indium gallium zinc oxide layer through a first yellow light processing so as to form a protection layer and an active layer, wherein the protection layer covers the active layer; settling a metal layer on a side of the protection layer away from the active layer; patterning the metal layer and the protection layer through second yellow light processing so as to form a source electrode, a drain electrode and an isolation zone, wherein the source electrode and the drain electrode are spaced from each other and are connected to the two ends of the active layer respectively and the isolation zone is formed on the protection layer and is disposed between the source electrode and the drain electrode. By adopting the above manufacture method, devices of the array substrate are good in performance.

Description

technical field [0001] The present invention relates to the technical field of array substrates, in particular to a method for manufacturing an array substrate. Background technique [0002] With the development of display technology, liquid crystal displays (Liquid Crystal Display, LCD) and other flat display devices are widely used in mobile phones, televisions, personal Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream of display devices. [0003] Most of the liquid crystal display devices currently on the market are backlight liquid crystal displays, which include a liquid crystal display panel and a back light module. The liquid crystal display panel consists of a color filter (Color Filter, CF) substrate, a thin film transistor (Thin Film Transistor, TFT) array substrate, a liquid crystal (Liquid Crystal, LC) sandwiched between the color filter substrate and the array ...

Claims

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Application Information

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IPC IPC(8): H01L21/77H01L27/12
CPCH01L27/1225H01L27/1259
Inventor 胡小波
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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