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Lead-free solder alloy with low cost and high melting point and preparation method thereof

A lead-free solder alloy, high melting point technology, used in welding equipment, metal processing equipment, welding/cutting media/materials, etc. Effect

Inactive Publication Date: 2017-09-19
雅拓莱焊接科技(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In addition, the lead-free solder alloy containing precious metals, the known Au~20Sn contains a high proportion of precious metal Au, which is expensive; for example, the published patent CN104520062B also contains 8~25% of precious metal Ag, and the cost price of Ag is about the cost price of Sn 28 times the cost of Sb, 65 times the cost of Sb, the cost is extremely expensive

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  • Lead-free solder alloy with low cost and high melting point and preparation method thereof
  • Lead-free solder alloy with low cost and high melting point and preparation method thereof

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preparation example Construction

[0069] The present invention also provides a method for preparing a lead-free solder alloy with low cost and high melting point, comprising the following steps:

[0070] Prepare and melt part of Sn with all other main components and auxiliary components except Sb components into master alloy;

[0071] Melting the remaining Sn and Sb in a vacuum induction heating furnace to generate an intermetallic compound Sb2Sn3, the melting temperature of which is 380-450° C., and fully stirring for 60-90 minutes; and

[0072] The intermetallic compound Sb2Sn3 which is dissolved and stirred evenly is added to the master alloy, cooled after being fully stirred, and a lead-free solder alloy with low cost and high melting point is prepared by casting.

[0073] In a specific implementation, the trace alloy is one or more of Co, Mn, Al and Si.

[0074] In specific implementation, the content and composition of the trace alloy are as follows:

[0075] 0.00~0.20%Co,

[0076] 0.00~0.20% Mn,

[...

Embodiment 1

[0094] The lead-free solder alloy with low cost and high melting point includes the following main components, auxiliary components and the balance Sn, calculated by weight percentage, the composition and content of the main components are as follows: Sb15%, Cu1.5%, Bi0.1% , Ni0.05%; the auxiliary components include microalloys for improving the microscopic crystal structure and trace antioxidants for anti-oxidation, the microalloys include Co0.05%, Mn0.1% and Si0.1%, The trace antioxidant includes P0.05% and Ge0.1%, and the balance is Sn.

[0095] The preparation method of the above-mentioned lead-free solder alloy with low cost and high melting point comprises the following steps:

[0096] Prepare part of Sn and all other main components and auxiliary components except Sb components and melt them into master alloy; the amount of Sn used in this step can be based on all other main components and auxiliary components except Sb components The content and the preparation ratio ...

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Abstract

The invention discloses a lead-free solder alloy with low cost and high melting point and a preparation method thereof. The lead-free solder alloy with low cost and high melting point comprises main components, auxiliary components and the balance of Sn; the main components comprise 12-25% of Sb, 0.1-5% of Cu, 0.01-0.5% of Bi, and 0.005-0.20% of Ni; and the auxiliary components comprise 0.0-0.20% of microalloy for improving a microcrystal structure, and 0.00-0.05% of micro antioxidant for resisting oxidation. The lead-free solder alloy with low cost and high melting point reaches a melting point temperature range of 241.5-299.2 DEG C, that is, the melting temperature is above 240 DEG C, and the liquid-phase line temperature reaches 299.2 DEG C; and meanwhile, the alloy contains no harmful substance lead.

Description

technical field [0001] The invention relates to the field of high lead-free solder alloys, in particular to a Sn-Sb-Cu-Bi-based lead-free solder alloy with low cost and high melting point and a preparation method thereof. Background technique [0002] Solder alloys are used in cutting-edge military, medical, and semiconductor electronics industries, while the melting point of SAC305 / SC07 / SAC105 / SAC0307 in conventional lead-free solder alloys is 217-227°C, and the melting point of SnSb5 is 232-240 ℃, because the melting point is too low to meet the applicable requirements, therefore, only lead-containing alloys or high-cost lead-free solder alloys containing precious metals can be used in the current industry. [0003] However, lead in lead-containing solder alloys is a heavy metal, and heavy metal lead is easy to accumulate in the human body, inhibiting the normal combination of proteins, easily invading the nervous system, and causing insanity, especially for infants and yo...

Claims

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Application Information

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IPC IPC(8): C22C13/02C22C1/03B23K35/26B23K35/40
CPCB23K35/262B23K35/40C22C1/03C22C13/02
Inventor 叶耀辉龚俊文
Owner 雅拓莱焊接科技(惠州)有限公司
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