Method for preparing novel anti-aging material for computer processor

Abstract

The invention provides a method for preparing a novel anti-aging material for a computer processor. The method comprises the following steps: a, mixing aluminum powder, copper powder, magnesium oxide and titanium dioxide, and performing ball milling to obtain a material I; b, mixing divinyl silicone oil and vinyl trimethoxy silane, adding the mixture into an internal mixer, stirring and mixing to obtain a material II; c, adding the material I into the material II, adding polypropylene silicone grease and ethyl acetate grafted copolymerized starch, mixing, and performing a mixing reaction in a chemical vapor deposition furnace to obtain a material III; d, adding pentaerythritol and sucrose polyester into the material III to perform an isobaric thermal gradient reaction to obtain a material IV; and e, mixing the material IV, polymethyl hydrogen siloxane, dipyrrolidone silane and chloroplatinic acid in a high frequency induction heating hot-press sintering furnace, and performing curing treatment. The novel anti-aging material is low in cost and simple in preparation method, and is suitable for industrial large-scale production.

Description

technical field [0001] The invention belongs to the technical field of polymer material production, and in particular relates to a preparation method of a novel anti-aging material used for computer processors. Background technique [0002] Computer processors will generate a lot of heat during work. If the heat dissipation measures are not proper, the temperature of the components will be too high, resulting in a decrease in its working performance or even damage. Therefore, it is necessary to install a heat dissipation device on the computer processor, such as a heat dissipation fan or a copper block, etc., and thermal conductive silica gel is usually filled between the heat dissipation device and the computer processor to promote heat transfer between the computer processor and the heat dissipation device. The existing heat-conducting silica gel is prone to aging during long-term use, resulting in a decrease in thermal conductivity and affecting the normal heat dissipatio...

AI Technical Summary

Problems solved by technology

The existing heat-conducting silica gel is prone to aging during long-term use, resulting in a decrease in thermal conductivity and affecting the normal heat dissipation of the computer processor

[0003] As the performance requirements of processors in the market are getting higher and higher, the power consumption of corresponding silicon chips is also increasing, and the problem of heat dissipation needs to be solved urgently. According to statistics, processor failures caused by overheating account for 60% of the total number of processor failures. %; The ideal state for the heat conduction material to exert the best heat conduction effect is to be in close contact with the heat source, but due to the limitation of processing accuracy, there are actually many gaps between the contact surfaces of the two, and the heat conduction silicone grease has good fluidity performance. Therefore, as a new type of heat-conducting thermal interface material, it is widely used to fill the gap between the processor and the heat sink; the thermal-conducting silicone grease will dry out and lose after many cycles of cold and heat, and aging will occur. Low, phase change energy storage is poor