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Brushless motor controller system facilitating mos transistor heat radiation

A mos tube, brushless motor technology, applied in the direction of a single motor speed/torque control, electric solid device, circuit, etc., can solve the problems of poor heat dissipation effect, increased power loss of mos tube, overheating damage, etc., which is conducive to heat dissipation. The effect of cooling, avoiding the increase of power loss and prolonging the service life

Pending Publication Date: 2017-10-20
苏州市普电电子电器厂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a brushless motor controller system that is conducive to the heat dissipation of mos tubes, so as to solve the problem that the poor heat dissipation effect of the printed circuit board of the lithium electric brushless electric tool in the prior art easily leads to increased power loss of the mos tubes or even Problems such as overheating damage

Method used

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  • Brushless motor controller system facilitating mos transistor heat radiation
  • Brushless motor controller system facilitating mos transistor heat radiation
  • Brushless motor controller system facilitating mos transistor heat radiation

Examples

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Embodiment 1

[0037] This embodiment provides a brushless motor controller system that facilitates the heat dissipation of the mos tube 6, wherein: figure 2The outline drawing of the brushless motor controller system that is beneficial to the heat dissipation of mos tube 6 provided by the present invention; image 3 A cross-sectional view of the controller 2 part of the brushless motor controller system that facilitates the heat dissipation of the mos tube 6 provided by the present invention; Figure 4 A schematic structural view of the ventilation base of the brushless motor controller system that is beneficial to the heat dissipation of the mos tube 6 provided by the present invention; Figure 5 A schematic structural diagram of the controller 2 of the brushless motor controller system that facilitates the heat dissipation of the mos tube 6 provided by Embodiment 1 of the present invention. like Figure 2-5 As shown, the brushless motor controller system provided by this embodiment to ...

Embodiment 2

[0046] This embodiment provides a brushless motor controller system that facilitates the heat dissipation of the mos tube 6, wherein: Image 6 A schematic structural diagram of the controller 2 of the brushless motor controller system that facilitates the heat dissipation of the mos tube 6 provided by Embodiment 2 of the present invention. like Figure 2~4 As shown in , 6 , the brushless motor controller system provided by this embodiment, which facilitates the heat dissipation of the mos tube 6 , includes a housing 1 , a motor body built in the housing 1 , and a controller 2 . The motor body and the controller 2 are electrically connected to each other.

[0047] Specifically, the controller 2 includes a ventilation base 3, a first circuit board 4, and a second circuit board 5;

[0048] Wherein, the mos tube 6 of the controller 2 is arranged on the second circuit board 5, and the remaining electronic components of the controller 2 are arranged on the first circuit board 4, a...

Embodiment 3

[0054] This embodiment provides a brushless motor controller system that facilitates the heat dissipation of the mos tube 6, wherein: Figure 7 A schematic structural diagram of the controller 2 of the brushless motor controller system that facilitates the heat dissipation of the mos tube 6 provided by Embodiment 3 of the present invention. like Figure 2~4 As shown in , 7 , the brushless motor controller system provided by this embodiment, which facilitates the heat dissipation of the mos tube 6 , includes a housing 1 , a motor body built in the housing 1 , and a controller 2 . The motor body and the controller 2 are electrically connected to each other.

[0055] Specifically, the controller 2 includes a ventilation base 3, a first circuit board 4, and a second circuit board 5;

[0056] Wherein, the mos tube 6 of the controller 2 is arranged on the second circuit board 5, and the remaining electronic components of the controller 2 are arranged on the first circuit board 4, ...

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Abstract

The invention provides a brushless motor controller system facilitating mos transistor heat radiation, and relates to the technical field of printed circuit boards. The brushless motor controller system facilitating mos transistor heat radiation comprises a shell and a motor body and a controller which are arranged in the shell. The motor body and the controller are electrically interconnected. The controller comprises a ventilation base, a first circuit board and a second circuit board. The mos transistors of the controller are arranged on the second circuit board. Other electronic components of the controller are arranged on the first circuit board. The first circuit board and the second circuit board are electrically connected. The ventilation base is provided with a ventilation port. The first circuit board and the second circuit board are arranged on the ventilation base. According to the brushless motor controller system facilitating mos transistor heat radiation, the mos transistors of high power consumption and high heat radiation are independently arranged on the second circuit board so that heat radiation and cooling of the mos transistors can be facilitated, increasing of power loss and even heat damage to the mos transistors can be avoided and the service life of the circuit system can be greatly prolonged.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a brushless motor controller system which facilitates the heat dissipation of mos tubes. Background technique [0002] Due to volume reasons, in the existing lithium battery brushless power tools, the metal-oxide semiconductor field effect transistor (usually called mos tube) in the brushless controller, the English full name: Metal-Oxide-Semiconductor Field-Effect Transistor MOSFET) is packaged in the form of to-252 (Transistor Out-line-252). This packaging method is to paste the mos tube on the printed circuit board of the FR-4 epoxy glass fiber cloth substrate. Since the traditional FR4 or CM-3 PCB board is not heat-conducting, the heat dissipation effect of the mos tube is poor. figure 1 It is a structural schematic diagram of a mos tube in a controller of a brushless motor in the prior art. In the prior art, such as figure 1 As shown, an aluminum plate 10 is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02P6/08H01L23/467
CPCH02P6/08H01L23/467
Inventor 陈涛涛
Owner 苏州市普电电子电器厂
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