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OLED packaging method and OLED packaging structure

A packaging method and packaging structure technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of film packaging layer fracture, height difference, device failure, etc., to reduce the probability of fracture, improve packaging effect, and excellent packaging effect. Effect

Active Publication Date: 2018-11-09
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Compared with liquid crystal display panels (TFT-LCD), the biggest advantage of OLED is that it can produce large-size, ultra-thin flexible OLED display devices. At present, flexible OLED display devices are a major research direction in the display field in the future, which mainly uses thin-film However, due to the height difference between the pixel area and the non-pixel area of ​​the OLED substrate, it is easy to make the thin film encapsulation layer form an uneven and uneven state during the thin film encapsulation process, and it is easy to cause thin film at the edge of the pixel area. The encapsulation layer breaks, causing the device to fail

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  • OLED packaging method and OLED packaging structure
  • OLED packaging method and OLED packaging structure
  • OLED packaging method and OLED packaging structure

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Embodiment Construction

[0037] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0038] see figure 1 , the present invention provides a kind of OLED encapsulation method, comprises the following steps:

[0039] Step 1, such as figure 2 As shown, a base substrate 10 is provided, and a light emitting pixel layer 20 is formed on the base substrate 10, and the light emitting pixel layer 20 includes several light emitting pixels 21 arranged at intervals.

[0040] Specifically, the thicknesses of the several light-emitting pixels 21 are close to or the same.

[0041] Specifically, the base substrate 10 is a flexible substrate, preferably a polyimide film.

[0042] Specifically, the plurality of light-emitting pixels 21 includes several red light-emitting pixels 211 , several green light-emitting pixels 212 and several blue l...

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Abstract

The invention provides an OLED packaging method and an OLED packaging structure. The OLED encapsulation method of the present invention realizes the flattening of the thin film encapsulation layer by forming a buffer particle layer, and reduces the probability of fracture of the thin film encapsulation layer at the edge of the light-emitting pixel. The encapsulation effect of the structure. The OLED encapsulation structure of the present invention realizes the planarization of the thin film encapsulation layer by setting the buffer particle layer, reduces the probability of fracture of the thin film encapsulation layer at the edge of the light-emitting pixels, and has excellent encapsulation effect.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED packaging method and an OLED packaging structure. Background technique [0002] Organic light-emitting diode (Organic Light-Emitting Diode, OLED) display, also known as organic electroluminescent display, is a new type of flat panel display device, due to its simple preparation process, low cost, low power consumption, high luminance, Wide range of working temperature, light and thin size, fast response speed, easy to realize color display and large-screen display, easy to realize matching with integrated circuit driver, easy to realize flexible display, etc., so it has broad application prospects. [0003] According to the driving method, OLED can be divided into two categories: passive matrix OLED (Passive Matrix OLED, PMOLED) and active matrix OLED (Active Matrix OLED, AMOLED), namely direct addressing and thin film transistor (TFT, Thin Film Transistor) There are tw...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/84H10K50/844H10K71/00
Inventor 黄辉
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD