Laminated optoelectronic interconnection printed board and its realization method

Abstract

The invention discloses a laminated photoelectric interconnection printed board and an implementation method therefor. The printed board comprises an upper substrate, a central substrate, a lower substrate, a light emitter, a light receiver, and an optical waveguide. The optical waveguide is set on the surface of the lower substrate, and the central substrate is pressed on the optical waveguide. The light emitter and the light receiver are pasted on the surface of the central substrate, and are aligned with a 45-degree coupling end face of the optical waveguide through optical through holes. The periphery of a laser and a detector is provided with a bonding pad array, and the same position on the surface of the upper substrate is provided with the same bonding pad array. Moreover, welding balls are implanted on all bonding pads of the upper substrate. A pin of the light receiver is connected to the bonding pads through a wire on the substrate, and the upper and central substrates are interconnected through the welding balls, thereby forming a three-layer laminated structure. The printed board irons out the defect that a light transceiver is liable to be damaged in the technological process of the high-temperature laminating of the printed board, and achieves the in-board assembly of photoelectric conversion and connection circuits.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, in particular to a laminated structure of a photoelectric interconnection printed board EOPCB and a realization method thereof, which can be used in the research of multilayer EOPB. Background technique [0002] With the development of electronic information technology, the demand for high-speed communication has shown explosive growth, and with the increase of data transmission rate and frequency, in the field of short-distance interconnection, especially between the internal chassis of electronic equipment, single In the interconnection between boards and chips, inherent properties such as skin effect and dielectric loss in traditional electrical interconnections will distort high-speed signals and limit bandwidth. The new optical interconnection has many characteristics, such as low energy consumption, EMI elimination, high bandwidth, and high speed. Based on these characteristics, ...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to address the deficiencies in the above-mentioned prior art, and propose a laminated photoelectric interconnection printed board and its implementation method, so as to avoid the problem of photonic devices failing during the high-temperature lamination process of the printed board, so that The photoelectric conversion and conduction path are completely completed in the substrate, which plays a protective role

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