Polyamide epoxy resin curing agent
A technology of epoxy resin curing and polyamide, applied in the field of curing agent, can solve the problems of low hardness, easy moisture absorption coating film, poor weather resistance of coating film, etc., and achieve the effect of good softness and toughness
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[0018] The present invention will be further described below in conjunction with the examples, which are preferred embodiments of the present invention.
[0019] Polyamide epoxy resin curing agent comprises each component of following weight parts:
[0020]
[0021]
[0022] Further, each component including the following parts by weight:
[0023]
[0024] Further, each component including the following parts by weight:
[0025]
[0026]
[0027] Preferably, the dibasic acid is selected from any one or a combination of adipic acid or sebacic acid.
[0028] Preferably, the long-chain polyetheramine is polyetheramine D-4000.
[0029] Preferably, the monoacid is stearic acid.
[0030] Preferably, the aromatic diamine is p-xylylenediamine or m-xylylenediamine.
[0031] Compared with the prior art, the polyamide epoxy resin curing agent of the present invention has the following beneficial effects: particularly good in softness and toughness.
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