Forming method of metal isolation gates
A metal isolation and metal layer technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of poor refraction and reflection of metal isolation grids, and low isolation performance of metal isolation grids, so as to avoid filling voids and improve performance and yield, easy to fill the effect
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[0027] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0028] refer to figure 1 , which is a flow chart of the method for forming the metal isolation barrier provided in the embodiment, such as figure 1 As shown, the forming method of the metal isolation barrier includes:
[0029] S1: providing a substrate, on which a metal layer and a barrier layer are sequentially formed;
[0030] S2: Etching the barrier layer and the metal layer with a partial thickness to form a trench;
[0031] S3: Etching the remaining metal layer in the trench to form a polymer, and the po...
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