Device and method for decreasing recast layer caused by laser micropore processing

Abstract

The invention provides a device and method for decreasing a recast layer caused by laser micropore processing. The device comprises a laser generator, a power box, a machine tool base, a machine tool body, a laser path reflecting mechanism, a loading mechanism and a splash recovery device. The method comprises the following steps that (1) a workpiece is clamped on the loading mechanism; (2) the angle of a laser path is adjusted according to the requirement of laser beam processing by controlling the laser path reflecting mechanism; (3) the laser generator is started, and laser beams generated by the laser generator act on the lower surface of the workpiece from bottom to top through the laser path reflecting mechanism; and (4) meanwhile, the splash recovery device blows air to the surface of the workpiece, so that laser drilling of the workpiece is completed under the combined action of the laser beams and thermal ionized gas. According to the method, by utilizing the gravity principle, liquid and vaporized mixtures generated in the laser drilling process are adsorbed and then recycled by the splash recovery device when instantly leaving a micropore and moving downwards, and accordingly, the purpose of decreasing the recast layer in the micropore is achieved.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a device and method for reducing a recast layer caused by laser microhole processing. Background technique [0002] With the rapid development of modern industry, especially in high-precision fields such as aerospace, automobiles, medical equipment, and electronic instruments, many components are designed with a large number of micropores to improve product performance and usability. When processing micro-holes on materials such as high hardness and brittleness, laser has more advantages than traditional processing methods, such as high efficiency, high precision, no mechanical stress and no tool loss, etc. Laser micro-hole processing technology has become the field of modern micro-hole processing. One of the key technologies, such as laser processing of air film holes in aero-engine turbine blades. [0003] Laser micro-hole processing technology uses laser beam as he...

AI Technical Summary

Problems solved by technology

However, in the actual processing process, the aperture of the prefabricated hole is not uniquely fixed, and the aperture varies in a wide range, and the outer diameter of the inner and outer guide sleeves and the rod-shaped electrode used in this patent are relatively large for the prefabricated hole. It is difficult to achieve one-to-one correspondence between the hole diameters, and the outer diversion sleeve is close to the workpiece during processing, so there is a great hidden danger to the damage to the inner wall structure of the micropores, especially in the area where the recasting layer is very thin

[0006] To sum up, the current laser machining process of micro-holes inevitably produces a recast layer on the inner wall of the micro-hole. The existing methods can reduce the re-cast layer to a certain extent, but there are generally difficulties in practical operation and easy damage to the hole. Disadvantages such as the matrix structure of the inner wall, especially the need for secondary processing or repair, further reduce the efficiency of laser microhole processing

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