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Printed circuit board

A printed circuit board, one-sided technology, applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve the problems of high product scrap rate, complex heat dissipation process and inconvenient maintenance.

Pending Publication Date: 2017-12-01
SHENZHEN GOLD POWER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a printed circuit board to solve the technical problems of the existing printed circuit board with complex heat dissipation process, high product scrap rate and inconvenient maintenance

Method used

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  • Printed circuit board

Examples

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Embodiment Construction

[0017] Such as figure 1 As shown, a printed circuit board includes a PCB board 1 and a power electronic component 2 mounted on one side of the PCB board 1 that generates heat during operation. The power electronic component 2 is such as a transistor, and the area of ​​the PCB board 1 corresponding to the power electronic component 2 A plurality of via holes 11 are provided inside, and a solder paste 3 is provided between the power electronic component 2 and the PCB board 1, and the solder paste 3 penetrates into the other side of the PCB board 1 through the plurality of via holes 11 and forms a solder paste layer on the other side 4. The solder paste layer 4 on the other side of the PCB board 1 is also provided with metal heat sink strips 5 such as copper strips that are in contact with the solder paste layer 4, and the PCB board 1 is also provided with metal heat sink strips 5 insertion holes 6 After bending, the metal heat sink strip 5 passes through the PCB board 1 through ...

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Abstract

The present invention relates to a printed circuit board. The printed circuit board comprises a PCB, a power electronic component installed at one surface of the PCB and capable of heating at work, a metal cooling fin strip is arranged at the other surface of the PCB, the PCB is provided with the insertion hole of the metal cooling fin strip, and the metal cooling fin strip is bended and then passes through the PCB through the insertion hole to be stretched into the heating area of the heating power electronic component. The heat emitted by the power electronic component can be directly conducted on the metal cooling fin strip at the other surface of the PCB through the metal cooling fin strip to perform heat radiation on the metal cooling fin strip with no need for a structure of laying one layer of insulation heat conduction materials and copper coating on an aluminum plate for heat radiation so as to solve the technical problems that the current printed circuit board is complex in technology, the product disability rate is high and the maintenance is not convenient.

Description

technical field [0001] The invention relates to a printed circuit board. Background technique [0002] Printed circuit boards are an important part of electronic products, including PCB boards and power electronic components mounted on one side of the PCB board that generate heat during operation. In the heat dissipation field of power electronic components, the heat dissipation process of power electronic components is a challenge , with the development of high-density power electronics, the heat dissipation of high-power-density power electronics is mainly through aluminum substrates and copper substrates to meet the requirements of high power density. Then pour copper to make a single-sided or multi-layer circuit board process, and then weld the power transistor on the aluminum substrate to conduct heat. The transistor passes through the circuit board, and the heat-conducting insulating material is conducted to the aluminum substrate in contact with it to achieve the purp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/0203H05K2201/10545
Inventor 彭伟锋张斌斌胡海卿严轶魏庆才蒋中为
Owner SHENZHEN GOLD POWER TECH
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