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Radiator of power amplifier

A power amplifier and radiator technology, applied in cooling/ventilation/heating transformation, modification with gaseous coolant, electrical components, etc., can solve the problem of low heat dissipation efficiency, and achieve the effect of simple installation and simple structure

Inactive Publication Date: 2017-12-26
成都西井科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to solve the problem of low heat dissipation efficiency in the prior art, and provides a heat sink for a power amplifier, providing two heat dissipation channels, and selecting the heat dissipation method according to different situations

Method used

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  • Radiator of power amplifier
  • Radiator of power amplifier
  • Radiator of power amplifier

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Embodiment

[0025] Such as figure 1 , 2 , shown in 3, a kind of radiator of power amplifier, comprises power amplifier 6, at least 10 heat sinks 1, controller, temperature sensor 7, AD converter 8; side, and an empty slot is arranged between the cooling fins 1, and a fan 2 is arranged in the empty slot; the controller is arranged inside the power amplifier 6; the temperature sensor 7 and the AD converter 8 are all arranged in the power On the other side of the amplifier 6 , the temperature sensor 7 is electrically connected to the AD converter 8 , and the AD converter 8 is electrically connected to the controller, and the controller is electrically connected to the fan 2 . Through the cooperation of the above-mentioned components, a heat dissipation system is formed. First, the temperature sensor 7 monitors the temperature of the power amplifier 6. When the temperature is too high, an alarm signal is sent to the controller through the AD converter 8, so that the controller turns on the f...

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Abstract

The invention discloses a radiator of a power amplifier. The radiator comprises the power amplifier, ten or more cooling fins, a controller, a temperature sensor and AD converters. The cooling fins are arrayed on one side of the power amplifier neatly, an empty groove is formed between every two adjacent cooling fins, and fans are arranged inside the empty grooves; the controller is arranged inside the power amplifier; the temperature sensor and the AD converters are arranged on the other side of the power amplifier, the temperature sensor is electrically connected with the AD converters which are electrically connected with the controller, and the controller is electrically connected with the fans. All the components are matched to form a cooling system, first, the temperature of the power amplifier is monitored through the temperature sensor, and when the temperature is too high, a warning signal is sent to the controller through the AD converters, so that the controller switches on the fans for cooling; under general conditions, the cooling fins can achieve a basic cooling effect, so that part of electricity loss is reduced.

Description

technical field [0001] The invention relates to an over-temperature protection device, in particular to a radiator of a power amplifier. Background technique [0002] Since 1974, the Plessey company of the United States has used GaAs FETs as active devices and GaAs semi-insulating substrates as carriers to successfully develop the world's first MMIC amplifier. Driven by aspects), the development of MMIC is very rapid. In the 1980s, with the development and progress of molecular beam epitaxy, metal organic chemical vapor deposition technology (MOCVD) and deep submicron processing technology, MMIC developed rapidly. In 1980, the High Electron Mobility Transistor (HEMT) was developed by the laboratories of Thomson-CSF and Fujitsu, which has achieved continuous breakthroughs and innovations in material structure. In 1985, Maselink used a pseudo-HEMT (PHEMT) made of an InGaAs channel with better performance, which made HEMT develop towards the direction of lower noise at the fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20172H05K7/20209H05K7/20409
Inventor 杨天翔
Owner 成都西井科技有限公司
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