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Nano solution, method for forming nano film on device, and device having nano film

A nano-coating and nano-solution technology, which is applied in the direction of surface coating liquid devices, coatings, anti-corrosion coatings, etc., can solve the problems of high cost, expensive raw materials of gas reactants, toxicity and flammability, etc.

Active Publication Date: 2017-12-29
NANO SHIELD TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the hydrophobic materials deposited on the surface of the substrate by PVD or PECVD technology usually have better quality, the raw materials of the gaseous reactants are expensive, which increases the production cost. In addition, in the process of PVD or PECVD manufacturing, the used Gas reactants are usually toxic or flammable, and may cause damage to electronic devices during high-temperature processes, so there are still great obstacles to the development of this technology
[0005] In summary, the existing preparation methods still need to be improved due to the disadvantages of high cost and difficulty in coating on the surface of electronic products.

Method used

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  • Nano solution, method for forming nano film on device, and device having nano film
  • Nano solution, method for forming nano film on device, and device having nano film
  • Nano solution, method for forming nano film on device, and device having nano film

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Embodiment Construction

[0035] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0036] It is to be appreciated that the following disclosure of this specification presents many different embodiments or examples, disclosing different features of various different embodiments. Of course, these specific examples are not intended to limit the present invention. In addition, different examples may use repeated reference symbols and / or words in the description of the present invention. These repeated symbols or words are used for the purpose of simplification and clarity, and are not used to limit the relationship between various embodiments and / or the described appearance structures. Furthermore, if the disclosure below in this specification describes that the first feature is formed on or above a second feature, it ...

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Abstract

A device having a nano film includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

Description

technical field [0001] The present invention relates to a nano-coating preparation and coating method, in particular to a nano-solution, a method of using the nano-solution to form a nano-coating on a device and a device with a nano-coating, the nano-coating can protect the device from Corrosion and moisture. Background technique [0002] The advancement of science and technology is gradually developing toward miniaturization, so how to suppress the moisture in the adsorption environment to reduce the occurrence of corrosion is becoming more and more important. As the size of integrated circuit components becomes smaller and smaller, the distance between components becomes closer. Therefore, when external environmental factors cause the conductive terminals to absorb moisture and form a small amount of metal corrosion, it is easy to cause the failure of the entire electronic component. Therefore, it is necessary to find a method for preparing an electronic device with a sup...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05D7/00B05D1/32C09D1/00C09D5/08H05K1/02C09D7/61
CPCB05D1/32B05D7/544C09D1/00C09D5/08H05K1/02H05K2201/0257H05K2203/1333C09D7/61C09D7/67C09D7/68H05K3/285H05K2201/0179C09D7/20H05K3/282H05K3/284H05K2203/1105H05K1/0306H05K1/181H05K2201/0175H05K2201/0191H05K2201/0195H05K2201/10015H05K2201/10022H05K2201/1003H05K2201/10166H05K2201/10174H05K2201/10189
Inventor 李政
Owner NANO SHIELD TECH CO LTD