Nano solution, method for forming nano film on device, and device having nano film

Abstract

A device having a nano film includes a printed circuit board assembly having a printed circuit board and one or more electronic components disposed on the printed circuit board, and a nanofilm disposed on the printed circuit board assembly. The nanofilm includes an inner coating in contact with the printed circuit board assembly, the inner coating including metal oxide nanoparticles having a particle diameter in a range of 5 nm to 100 nm; and an outer coating in contact with the inner coating, the outer coating including silicon dioxide nanoparticles having a particle diameter in a range of 0.1 nm to 10 nm.

Description

technical field [0001] The present invention relates to a nano-coating preparation and coating method, in particular to a nano-solution, a method of using the nano-solution to form a nano-coating on a device and a device with a nano-coating, the nano-coating can protect the device from Corrosion and moisture. Background technique [0002] The advancement of science and technology is gradually developing toward miniaturization, so how to suppress the moisture in the adsorption environment to reduce the occurrence of corrosion is becoming more and more important. As the size of integrated circuit components becomes smaller and smaller, the distance between components becomes closer. Therefore, when external environmental factors cause the conductive terminals to absorb moisture and form a small amount of metal corrosion, it is easy to cause the failure of the entire electronic component. Therefore, it is necessary to find a method for preparing an electronic device with a sup...

AI Technical Summary

Problems solved by technology

Although the hydrophobic materials deposited on the surface of the substrate by PVD or PECVD technology usually have better quality, the raw materials of the gaseous reactants are expensive, which increases the production cost. In addition, in the process of PVD or PECVD manufacturing, the used Gas reactants are usually toxic or flammable, and may cause damage to electronic devices during high-temperature processes, so there are still great obstacles to the development of this technology

[0005] In summary, the existing preparation methods still need to be improved due to the disadvantages of high cost and difficulty in coating on the surface of electronic products.

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