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Medium integrated suspended line circuit structure based on 3D printing

A technology of circuit structure and medium integration, applied in printed circuits, printed circuit parts, electrical components, etc., can solve the problems of complex processing and low space utilization of medium-integrated suspension lines, and achieve simple processing and high space utilization. Effect

Active Publication Date: 2017-12-29
UNIV OF ELECTRONIC SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a medium-integrated suspension line circuit based on 3D printing, which solves the technical problems of low space utilization rate and complicated processing of the existing medium-integrated suspension line, and realizes high space utilization rate of the medium-integrated suspension line , the technical effect of simple processing

Method used

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  • Medium integrated suspended line circuit structure based on 3D printing
  • Medium integrated suspended line circuit structure based on 3D printing
  • Medium integrated suspended line circuit structure based on 3D printing

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Embodiment 1

[0027] The medium-integrated suspension line circuit based on 3D printing technology mainly includes four parts: the circuit part, which is used to design the required circuit; the circuit fixing part, which is used to connect the circuit part with the cavity wall, so that the circuit part is fixed and has enough The mechanical strength; the cavity part, between the circuit part and the cavity wall, is used to transmit energy and reduce dielectric loss; the cavity wall is used to encapsulate the entire suspension line circuit, reduce radiation loss, and enhance the overall structure mechanical strength. Each part of the circuit part, the circuit fixing part, the cavity part and the cavity wall can be in any regular / irregular three-dimensional shape. The number of cavities in the cavity part can be 1 or more.

[0028] Further, the cavity wall, the circuit part, and the circuit fixing part can all be printed from non-conductive materials such as photosensitive resin, thermoplas...

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Abstract

The invention discloses a medium integrated suspended line circuit structure based on 3D printing, and the circuit structure comprises a circuit part which is used for designing a required circuit; a circuit fixing part which is used for connecting the circuit part and a cavity wall; a cavity part which is located between the circuit part and the cavity wall and is used for transmitting energy; and the cavity wall which is used for packaging the whole suspended line circuit. The structure solves technical problems that a conventional medium integrated suspended line is not high in space utilization rate and is complex in processing, achieves the high utilization rate of the space of the medium integrated suspended line, and is simple in processing.

Description

technical field [0001] The invention relates to the research field of medium-integrated suspension wires, in particular to a circuit structure of medium-integrated suspension lines based on 3D printing. Background technique [0002] With the rapid development of wireless communication technology, microwave and millimeter wave integrated circuits have put forward higher and higher requirements for low loss, low cost, light weight, and flexibility. As the most basic component of microwave and millimeter wave circuits and systems, transmission lines have characteristics such as volume, loss, and weight that directly or indirectly determine the size and performance of microwave and millimeter wave circuits and systems. [0003] The dielectric integrated suspension line processed by traditional technology is a transmission line formed by laminating multiple layers of top-to-bottom double-sided printed circuit boards. The upper and lower surfaces of the middle layer circuit board ...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K3/10
CPCH05K1/119H05K3/10
Inventor 马凯学陈殷洲王勇强
Owner UNIV OF ELECTRONIC SCI & TECH OF CHINA
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