High-temperature-resisting copolyamide hot melt adhesive for shoe material and processing method

A copolyamide and hot-melt adhesive technology, applied in the direction of polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problem of low bonding strength, achieve high bonding strength, wide application range, and good flexibility Effect

Inactive Publication Date: 2018-01-09
温州华特热熔胶股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN 103289065A discloses a high-temperature-resistant polyes

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 120g of dimer acid, 10.6g of sebacic acid, and 45.7g of decanediamine were dropped into a 1000ml three-port reactor with a thermometer, a stirring bar, and a condensing tube at one time, and catalysts and additives were added. Increase the pressure and start stirring slowly. During the heating process, water will distill out. After the temperature rises to 200°C, use a vacuum pump to evacuate, the vacuum degree is <100Pa, keep stirring, and release the vacuum after 2 hours. Pour the molten copolyamide on the isolation On the paper, a long strip of glue was obtained, and after drying in an oven at 50°C for 24 hours, various tests were performed.

Embodiment 2

[0026] Put 120g of dimer acid, 10g of azelaic acid, and 45.7g of decanediamine into a 1000ml three-port reactor with a thermometer, a stirring bar, and a condensing tube at one time, add a catalyst, a small amount of auxiliary agent, and use normal pressure within 2 hours Heat up, start stirring slowly, water distills out during the heating process, after the temperature rises to 200°C, use a vacuum pump to evacuate, the vacuum degree is <100Pa, keep stirring, release the vacuum after 2 hours, and pour the melted copolyamide on the release paper After drying in an oven at 50°C for 24 hours, various tests were performed.

Embodiment 3

[0028] Put 120g of dimer acid, 11.3g of undecanedioic acid, and 30g of caprolactam into a 1000ml three-port reactor with a thermometer, a stirring bar, and a condenser at one time, add catalysts, small additives, and return to normal pressure within 2 hours Heat up, start stirring slowly, water distills out during the heating process, after the temperature rises to 200°C, use a vacuum pump to evacuate, the vacuum degree is <100Pa, keep stirring, release the vacuum after 2 hours, and pour the melted copolyamide on the release paper After drying in an oven at 50°C for 24 hours, various tests were performed.

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PUM

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Abstract

The invention discloses a high-temperature-resisting copolyamide hot melt adhesive for a shoe material and a processing method. The hot melt adhesive is prepared from 50 percent of a component A and 50 percent of a component B according to the mol percent under the action of a catalyst, an auxiliary agent material and a surface drying regulator, wherein in the component A, the mol ratio of dimer acid is 70 percent to 90 percent and the mol ratio of fatty dibasic acid is 10 percent to 30 percent; the component B is diamine. The mol ratio of the dimer acid is 80 percent and the mol ratio of thefatty dibasic acid is 20 percent. The dimer acid is formed by octadecadienoic acid through mutual polymerization between molecules. The dimer acid comprises monomer acid, trimer or polymer, wherein inthe dimer acid, the content of the dimer acid is greater than or equal to 98 percent, the content of the monomer acid is less than or equal to 0.5 percent and the content of the trimer and the polymer is less than or equal to 2 percent. The high-temperature-resisting copolyamide hot melt adhesive for the shoe material has the beneficial effects of high temperature resistance, wide application range, good flexibility and high bonding strength.

Description

technical field [0001] The invention relates to a hot-melt adhesive for shoe materials and a processing method, in particular to a hot-melt adhesive for shoe materials suitable for high temperature resistance. Background technique [0002] When making shoes, there are mainly shoe uppers, outsoles, main heels, toe caps, heels, shanks and insoles that need to be bonded. The upper of a shoe is mostly materials such as natural leather, artificial leather and fabric, and the sole is mostly materials such as rubber and plastics. Chinese patent CN 103289065A discloses a high-temperature-resistant polyester hot-melt adhesive for shoemaking, but its bonding strength is not high. Contents of the invention [0003] Based on the above disadvantages, the present invention provides a high-temperature-resistant copolyamide hot-melt adhesive for shoe materials. The invention uses a dimer acid-type hot-melt adhesive, which is especially suitable for compounding high-temperature-resistant ...

Claims

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Application Information

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IPC IPC(8): C09J177/08C09J177/02C09J11/08C08G69/34C08G69/36
Inventor 陈宇周庆伟代本祝
Owner 温州华特热熔胶股份有限公司
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