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Copper powder metal coating, metal substrate, energy-saving and anti-burst heat-dissipation device and preparation process thereof

A metal coating, metal substrate technology, applied in the direction of cooling/ventilation/heating transformation, to solve the technical bottleneck, strong capillary force, good evaporation performance

Active Publication Date: 2018-01-09
林进东
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the metal coating in the prior art is difficult to achieve a thickness of less than 1 mm, and the thinnest heat pipe of a mobile phone can only be 0.6 mm

Method used

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  • Copper powder metal coating, metal substrate, energy-saving and anti-burst heat-dissipation device and preparation process thereof
  • Copper powder metal coating, metal substrate, energy-saving and anti-burst heat-dissipation device and preparation process thereof
  • Copper powder metal coating, metal substrate, energy-saving and anti-burst heat-dissipation device and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0069] A preparation process for copper powder metal coating, comprising the following steps,

[0070] a. Cleaning of the metal substrate, specifically, use 5%-15% dilute sulfuric acid to clean for 4-5 minutes, and then pass pure water at least three times to clean the surface of the metal substrate. Among them, the metal substrate can be copper plate, aluminum plate, zinc plate , tin plate, titanium plate or stainless steel plate, etc.;

[0071] b. Wrap the other surfaces of the metal substrate, and only leak out the working surface where the metal layer needs to be attached;

[0072] c. Adhesive metal layer;

[0073] Use the jig to immerse the metal substrate that only leaks out of the working surface into the working tank. During the attachment process, keep the temperature of the liquid in the working tank at 1-10 degrees Celsius, so that the shape of the copper powder can be controlled to be snowflake or coral. Liquid temperature is the key to determine the effect of el...

Embodiment 2

[0088] A preparation process of a copper powder metal coating, other features are the same as in Example 1, the difference is that it also has the following technical features: the preparation process of the copper powder metal coating of the present embodiment, a process for attaching a snowflake-shaped metal layer Yes: the current is controlled at 2.0 amps, adhered for 2 minutes, and a copper powder metal coating with a thickness of 0.1MM is obtained.

[0089] Through the control of this process, the capillary performance of the prepared copper powder metal coating is better, and 1ml of water droplets can be completely absorbed within 0.05 seconds.

[0090] The preparation process of the copper powder metal coating of the present invention has the advantages of energy saving and environmental protection, and the prepared copper powder metal coating has firm adhesion to the metal substrate. The prepared electroplating layer has a snowflake-like multi-layer structure under a f...

Embodiment 3

[0104]A preparation process of an energy-saving anti-explosion and anti-explosion heat dissipation device, comprising the following steps,

[0105] (1) prepare the copper powder electroplating copper powder metal coating by the process of embodiment 1 or 2 respectively to the metal substrate as upper plate and lower plate;

[0106] (2) The upper plate and the lower plate electroplated with copper powder metal coating are sealed around by laser welding;

[0107] (3) Use high-frequency welding degassing head 600 to obtain a vapor chamber, and then inject refrigerant into the vapor chamber through the degassing head;

[0108] (4) Vacuum for the first time to make the air pressure inside the cavity reach 6.0 -1 to 8.0 -2 Pa;

[0109] (5) Secondary degassing, heating the vapor chamber for the first vacuuming to 100-150 degrees Celsius, preferably 120 degrees Celsius, so that the gas that cannot be exhausted in step (4) is concentrated on the top of the degassing head, and then r...

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Abstract

The invention provides a preparation process of a copper powder metal coating, a metal substrate with the metal coating, an energy-saving and anti-burst heat-dissipation device and a preparation process thereof. The preparation process of the copper powder metal coating comprises the step of metal layer adhesion. During adhesion, the temperature of liquid in a working tank is 1-15 DEG C. The stepof metal layer adhesion at least comprises the processes of adhesion of a base coat, adhesion of a snowflake-shaped metal layer and adhesion of a fastening layer, and the metal layer which is obtainedby adhesion and has a snowflake-shaped structure is large in capillary force and good in evaporating property. The metal substrate with the copper powder metal coating and the energy-saving and anti-burst heat-dissipation device are energy-saving and environmentally friendly in the preparation process, and have the large capillary force and good evaporating property; the hardness of the metal substrate can be maintained; and the swelling resistance is good. The thickness of the energy-saving and anti-burst heat-dissipation device can be 0.3 mm, and the technological difficulty that the thickness of a heat tube heat-dissipation device in the prior art only can be 0.6 mm is solved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices, in particular to a preparation process of a copper powder metal coating, a metal substrate with the copper powder metal coating, an energy-saving anti-explosion heat dissipation device and a preparation process thereof. Background technique [0002] With the gradual development of electronic products in the direction of integration and high speed, the heat dissipation performance of electronic products has become an urgent problem to be solved to ensure the quality of electronic products. [0003] In the prior art, heat dissipation devices mostly use heat dissipation fins to dissipate heat, and some fans are added to improve air flow in order to improve heat dissipation efficiency. However, this heat dissipation method is still difficult to meet the efficiency requirement of rapid heat dissipation. How to absorb heat in a short period of time and quickly transfer and release hea...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/34C25D7/00B23P15/26H05K7/20
Inventor 林进东杨奥龙
Owner 林进东
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