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A kind of high-temperature-resistant silicone gel for high-power igbt encapsulation and its preparation method and application

A high-power, high-temperature-resistant technology, applied in the field of silicone gel, can solve the problem of difficult to meet the use temperature, and achieve the effect of improving heat resistance, tight cross-linking, good light transmittance and cross-linking density

Active Publication Date: 2021-01-19
ZHUZHOU TIMES ELECTRIC INSULATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The operating temperature of the current conventional silicone gel is below 200°C. As the power of electronic components gradually increases, higher and higher requirements are put forward for the temperature resistance and insulation performance of the silicone gel. The conventional silicone gel Glue can no longer meet the requirements for the use of new electronic components. For example, the high-power SiC-type IGBT (insulated gate bipolar transistor) components that have developed particularly rapidly in recent years have put forward higher performance requirements for the temperature resistance of packaging materials. , requires a long-term use temperature > 220 ° C, but the use temperature of the current silicone gel is difficult to meet this requirement

Method used

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  • A kind of high-temperature-resistant silicone gel for high-power igbt encapsulation and its preparation method and application
  • A kind of high-temperature-resistant silicone gel for high-power igbt encapsulation and its preparation method and application
  • A kind of high-temperature-resistant silicone gel for high-power igbt encapsulation and its preparation method and application

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Experimental program
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Effect test

Embodiment 1

[0038] A high-temperature-resistant silicone gel for high-power IGBT packaging of the present invention includes component A and component B, wherein component A is formed by mixing the following raw materials by mass fraction:

[0039] Vinyl silicone oil 10kg;

[0040] Platinum catalyst 0.3kg;

[0041] Component B is made by mixing the following raw materials by mass:

[0042]

[0043] Among them, the vinyl silicone oil is methyl phenyl-terminated vinyl silicone oil with a vinyl content of 0.30%, the mass ratio of the phenyl content is 20%, the viscosity is 1000 mPa·s, and the purity is > 99.98%; Hydrogen silicone oil, its hydrogen content is 0.50%, the mass ratio of phenyl content is 15%, the purity is more than 99.98%, and the viscosity is 15mPa s; the chain extender is 0.10% hydrogen content and 10% phenyl content mass ratio- 50% (15%), purity>99.98%, methylphenyl hydrogen-containing silicone oil with viscosity of 10mPa·s; wherein the platinum catalyst is Shin-Etsu pl...

Embodiment 2

[0057] A high-temperature-resistant silicone gel for high-power IGBT packaging of the present invention includes component A and component B, wherein component A is formed by mixing the following raw materials by mass fraction:

[0058] Vinyl silicone oil 10kg;

[0059] Platinum catalyst 0.3kg;

[0060] Component B is made by mixing the following raw materials by mass:

[0061]

[0062] Among them, the vinyl silicone oil is methylphenyl-terminated vinyl silicone oil with a vinyl content of 0.23%, the mass ratio of the phenyl content is 10%, the viscosity is 1000mPa·s, and the purity is >99.98%; the crosslinking agent is the hydrogen content of 0.65% , methyl phenyl hydrogen-containing silicone oil with phenyl content mass ratio of 28%, purity > 99.98%, and viscosity of 30mPa s; chain extender is hydrogen content of 0.12%, phenyl content mass ratio of 25%, purity > 99.98% methylphenyl hydrogen-containing silicone oil with a viscosity of 20mPa·s; platinum catalyst is Shin-E...

Embodiment 3

[0076] A high-temperature-resistant silicone gel for high-power IGBT packaging of the present invention includes component A and component B, wherein component A is formed by mixing the following raw materials by mass fraction:

[0077] Vinyl silicone oil 10kg;

[0078] Platinum catalyst 0.3kg;

[0079] Component B is made by mixing the following raw materials by mass:

[0080]

[0081] Among them, the vinyl silicone oil is methylphenyl-terminated vinyl silicone oil with a vinyl content of 0.32%, the mass ratio of the phenyl content is 20%, the viscosity is 1000mPa·s, and the purity is >99.98%; the crosslinking agent is a hydrogen content of 0.52% %, the phenyl content mass ratio is 25%, the purity is >99.98%, the viscosity is 20mPa·s methyl phenyl hydrogen-containing silicone oil, the chain extender is the hydrogen content 0.18%, the phenyl content mass ratio is 15%%, Methylphenyl hydrogen-containing silicone oil with purity >99.98% and viscosity of 15mPa·s; platinum cat...

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Abstract

The invention discloses high-temperature-resisting organic silica gel for packaging a high-power IGBT (Insulated Gate Bipolar Translator). The high-temperature-resisting organic silica gel is preparedfrom a component A and a component B, wherein the component A is prepared by mixing the following raw materials: vinyl silicone oil and a platinum catalyst; the component B is prepared by mixing thefollowing raw materials: vinyl silicone oil, MDT phenyl silicone resin, a cross-linking agent, a chain extender, an inhibitor and an antioxidant; the vinyl silicone oil is methyl phenyl vinyl siliconeoil; based on the mass percent, the content of vinyl is 0.1 percent to 5 percent and the content of phenyl is 10 percent to 50 percent; the viscosity is 1000mPa.s to 10000mPa.s. The invention furthercorrespondingly discloses a preparation method of the high-temperature-resisting organic silica gel and a specific application method. The high-temperature-resisting organic silica gel disclosed by the invention can bear high temperature which is 220 DEG C or more, does not become yellow and still can keep good rigidity, damping property and cohesive property.

Description

technical field [0001] The invention belongs to the technical field of silicon gel, and in particular relates to a high-temperature-resistant organic silicon gel for high-power IGBT packaging and a preparation method and application thereof. Background technique [0002] The current operating temperature of conventional silicone gels is below 200°C. As the power of electronic components gradually increases, higher and higher requirements are placed on the temperature resistance and insulation properties of silicone gels. Glue can no longer meet the requirements of new electronic components. For example, high-power SiC IGBT (insulated gate bipolar transistor) components, which have developed rapidly in recent years, have put forward higher performance requirements for the temperature resistance of packaging materials. , the long-term use temperature is more than 220°C, and the current use temperature of the silicone gel is difficult to meet this requirement. SUMMARY OF THE ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08J3/24C08G77/20C08G77/34
Inventor 黎超华曾亮侯海波衷敬和朱伟蒋大伟李忠良李鸿岩姜其斌
Owner ZHUZHOU TIMES ELECTRIC INSULATION
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