Recycling method of waste copper clad laminates
A technology of copper clad laminates and plates, which is applied in the field of recycling waste copper clad laminates, can solve the problem of small amount of non-metallic residues of copper clad laminates, and achieve the effect of improving mechanical strength, good water resistance and mechanical strength, and compact internal structure
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Embodiment 1
[0018] The recycling method of waste copper-clad laminate in embodiment 1 comprises the following steps:
[0019] S1: Break the waste copper-clad laminate into fragments with a diameter of 1-2 cm, and separate metallic copper and non-metallic residues through a hydraulic shaker;
[0020] S2: Mix styrene and coupling agent evenly, add the non-metallic residue obtained in S1 and the adhesive containing accelerator, curing agent and unsaturated polyester in sequence under stirring, and transfer to the mold after stirring evenly;
[0021] S3: Clamp the mold mechanically, keep the mold pressure at 12 MPa and vibrate for 5 minutes, demould to obtain a wood-based panel blank, transfer the wood-based panel blank into a curing box, keep warm at 90°C for 5 hours, grind and polish to obtain a wood-based panel;
[0022] The weight percentage of non-metal residue in the artificial board is 65%.
[0023] The weight fraction of each component in the adhesive in S2 is: 99.5 parts of unsatura...
Embodiment 2
[0028] The difference between embodiment 2 and embodiment 1 is:
[0029] In S3, mechanically close the mold, keep the mold pressure at 18 MPa and vibrate for 3 minutes, demould to obtain the artificial panel blank, transfer the artificial panel blank into the curing box, keep it at 105°C for curing for 3 hours, grind and polish to obtain the artificial panel;
[0030] The weight percentage of the non-metallic residue in the artificial board is 80%.
[0031] The weight fraction of each component in the adhesive in S2 is: 98 parts of unsaturated resin, 0.5 part of accelerator, 0.1 part of curing agent, and the balance is phosphorus-containing flame retardant.
[0032] The weight ratio of styrene and non-metal residue is 2.5%, and the weight ratio of coupling agent and non-metal residue is 0.1%.
[0033] The coupling agent is a combination of titanate coupling agent, aluminate coupling agent and borate coupling agent in a weight ratio of 2:1:1.
[0034] The accelerator is an im...
Embodiment 3
[0036] The difference between Example 3 and Example 1 is that S3: Mechanical mold closing, keeping the mold pressure at 15 MPa and vibrating for 4 minutes, demoulding to obtain a wood-based panel blank, transferring the wood-based panel blank to a curing box, keeping it warm at 97°C for 4 hours, grinding and polishing , to get man-made panels;
[0037] The weight percentage of non-metal residue in the artificial board is 72%.
[0038] The weight fraction of each component in the adhesive in S2 is: 99.1 parts of unsaturated resin, 0.5 part of accelerator, and 0.4 part of curing agent.
[0039] The weight ratio of styrene and non-metal residue is 1%, and the weight ratio of coupling agent and non-metal residue is 0.8%.
[0040] The coupling agent is borate coupling agent. The accelerator is cobalt naphthenate.
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Abstract
Description
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