A kind of preparation method of tungsten-copper-silver composite powder

A composite powder and tungsten-copper technology, which is applied in liquid chemical plating, coating, metal material coating process, etc., can solve the problems of many processes, low product impurities, high cost, etc., and achieve tight bonding and uniformity of the coating , the effect of high purity

Active Publication Date: 2019-03-19
烟台屹海新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this process has problems such as long preparation cycle, high cost, and difficulty in mass production.
Each process of the spray drying method is easy to control, and the oxide precursor after drying and atomization is generally spherical and empty, and the product has low impurities, which is suitable for large-scale industrial production, but there are many processes and high energy consumption

Method used

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  • A kind of preparation method of tungsten-copper-silver composite powder
  • A kind of preparation method of tungsten-copper-silver composite powder
  • A kind of preparation method of tungsten-copper-silver composite powder

Examples

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Effect test

Embodiment 1

[0028] A preparation method of tungsten-copper-silver composite powder, comprising the steps of:

[0029] 1) Take 1 kg of tungsten powder and add it to 250 ml of wetting agent ethanol and soak for 1 hour, then rinse with deionized water after taking it out;

[0030] 2) Then add tungsten powder into the copper plating solution with a volume of 40L. The content of each substance in the copper plating solution is: copper nitrate 10g / L, EDTA 25g / L, use NaOH to adjust the pH of the copper plating solution to 11-12 , control the temperature at 60°C and stir for 10 minutes, then rinse with deionized water, and use a centrifuge to separate the copper-plated tungsten powder;

[0031] 3) Add 120 mL of formaldehyde solution and 10 kg of deionized water to the copper-coated tungsten powder obtained above, and stir mechanically at a high speed to disperse the copper-coated tungsten powder evenly;

[0032] 4) Under stirring conditions, add 220g of trisodium citrate into 1000ml of aqueous s...

Embodiment 2

[0035] A preparation method of tungsten-copper-silver composite powder, comprising the steps of:

[0036] 1) Take 1 kg of tungsten powder and add it to 130 ml of wetting agent isopropanol and soak for 1 hour, then rinse with deionized water after taking it out;

[0037] 2) Then add tungsten powder into the copper plating solution with a volume of 40L. The content of each substance in the copper plating solution is: copper chloride 10g / L, EDTA 10g / L, use NaOH to adjust the pH of the copper plating solution to 11~ 12. Control the temperature at 50°C and stir for 15 minutes, then rinse with deionized water, and use a centrifuge to separate the copper-plated tungsten powder;

[0038] 3) Add 120 g of potassium sodium tartrate and 10 kg of deionized water to the copper-plated tungsten powder obtained above, and stir mechanically at a high speed to disperse the copper-plated tungsten powder evenly;

[0039] 4) Under agitation, add 850 g of triethanolamine into 1000 ml of aqueous sol...

Embodiment 3

[0042] A preparation method of tungsten-copper-silver composite powder, comprising the steps of:

[0043] 1) Take 1 kg of tungsten powder and add it to 1250 ml of wetting agent acetone and soak for 1 hour, then rinse with deionized water after taking it out;

[0044] 2) Then tungsten powder is added to the copper plating solution with a volume of 40L. The content of each substance in the copper plating solution is: copper sulfate 10g / L, trisodium citrate 15g / L, and NaOH is used to adjust the pH of the copper plating solution to 12-14, control the temperature at 60°C and stir for 20 minutes, then rinse with deionized water, and use a centrifuge to separate the copper-plated tungsten powder;

[0045] 3) Add 200 g of hydrazine sulfate and 10 Kg of deionized water to the copper-plated tungsten powder obtained above, and stir mechanically at a high speed to disperse the copper-plated tungsten powder evenly;

[0046] 4) Under stirring conditions, add 240g of trisodium citrate and 2...

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Abstract

The invention relates to a preparation method of a tungsten-copper-silver composite powder, which comprises soaking the tungsten powder in a wetting agent, and then placing the tungsten powder in an alkaline copper plating solution for copper plating. The copper plating solution is composed of soluble Alkaline complexed copper ion solution formed by copper salt and copper ion complexing agent, and finally add the reducing agent solution to the copper-plated tungsten powder, stir to disperse the copper-plated tungsten powder evenly, and add the silver ion complexing agent under stirring condition The complexed silver salt solution is prepared in the silver salt solution, and the complexed silver salt solution is added to the mixture of the copper-plated tungsten powder and the reducing agent, and the reduction reaction occurs for 30-90 minutes, and the tungsten-copper-silver composite powder is obtained. The present invention The tungsten-copper-silver composite powder obtained by the method has the characteristics of smooth and uniform copper-plated silver-plated, tightly bonded coatings, high purity, etc., and can be mass-produced, and can be widely used in medium and high-voltage electrical appliances, communications, aviation, machinery, Electronics, metallurgy, aerospace and military and other fields.

Description

technical field [0001] The invention relates to a preparation method of a composite powder, in particular to a preparation method of a tungsten-copper-silver composite powder, and belongs to the technical field of surface chemical treatment. Background technique [0002] Tungsten powder has the characteristics of high melting point, high density, high hardness, low saturated vapor pressure, and small thermal expansion coefficient. It is used in the fields of medium and high voltage electrical appliances, communications, aviation, machinery, electronics, metallurgy, aerospace and military industry. Tungsten-copper-silver composite materials are used in high-voltage electrical contacts and high-voltage capacitors because of their high-voltage resistance, electrical ablation resistance, and high hardness. They are also used in the aerospace field as welding electrode materials. Electronic packaging technology is an important part of the modern electronics industry. The level o...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/02C23C18/40
Inventor 宋曰海马丽杰
Owner 烟台屹海新材料科技有限公司
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