Flat film-type cooling device

Abstract

A flat film heat dissipation device, comprising: an upper metal heat dissipation layer in the form of a flat plate with a thickness of 0.01 to 0.20mm; a lower metal heat dissipation layer in the form of a flat plate with a thickness of 0.01 to 0.20mm, and Corresponding to the upper metal heat dissipation layer; and a resin layer, located between the upper metal heat dissipation layer and the lower metal heat dissipation layer, and set as a thin film micropipe with a heat pipe pattern, so that the upper film surface and the lower film surface of the thin film micropipe They are combined with the lower surface of the upper metal heat dissipation layer and the upper surface of the lower metal heat dissipation layer respectively, and a heat dissipation fluid can be stored in the thin film micropipe to form a flat thin film heat dissipation device formed by compounding the microheat pipe and the heat dissipation fin.

Description

technical field [0001] The invention relates to a flat-film heat dissipation device, which is composed of micro heat pipes and heat sinks, and specifically realizes the design of a heat dissipation device combining thin micro heat pipes and heat sinks with high efficiency, active and passive combination. Background technique [0002] Mobile electronic devices tend to be thinner and multitasking, and due to the increase in the density and frequency of electronic components, local overheating will occur after a long period of use. This phenomenon not only brings consumers a bad experience of overheating and tactility In other words, the chip of a mobile electronic device is usually the main heat source when it is working. The heat dissipation is not only to reduce the temperature of the chip itself to ensure that it can work normally within the required temperature range, but also to prevent local overheating of the shell during heat dissipation. To cause bad user experience f...

AI Technical Summary

Problems solved by technology

[0010] The main technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art, and provide a flat film type heat sink, which is compositely formed with a micro heat pipe and a heat sink, to solve the deformation and problems of the thin micro heat pipe in the prior art. The problem of uneven heat dissipation has the function of improving the stability of the molding and strengthening the uniformity of heat dissipation; it is formed by composite molding of micro heat pipes and heat sinks to solve the problem of uniform heat dissipation of thin micro heat pipes and heat sinks in the prior art, and has the function of The reliability of the mobile electronic device can be maintained; it is compositely molded with a micro heat pipe and a heat sink to solve the problem of the different facets of the heat pipe type and the plane area of ​​the heat sink in the prior art, thereby reducing the temperature in the cavity of the mobile electronic device thermal disorder, and effectively remove heat to the outside of the cavity of the mobile electronic device; it is compositely formed with micro heat pipes and heat sinks to solve the problems of manufacturing cost and assembly time of thin micro heat pipes and heat sinks in the prior art, and thus has the advantages of Improve the efficiency of manufacturing convenience and assembly yield

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