Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Plastic packaging mould and plastic packaging method

A plastic sealing mold and plastic sealing technology, applied in the direction of coating, etc., can solve the problems of semiconductor package thickness, single length and width, single initial depth of injection groove, etc., to improve production efficiency and production efficiency, and improve machine utilization , Improve the effect of market competitiveness

Pending Publication Date: 2018-02-16
HUANWEI ELECTRONICS SHANGHAI CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the injection groove of the existing packaging mold has only a single initial depth, so the thickness and the length and width of the semiconductor package obtained by using this packaging mold are also single.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plastic packaging mould and plastic packaging method
  • Plastic packaging mould and plastic packaging method
  • Plastic packaging mould and plastic packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081] Such as Figure 1-10 As shown, a plastic sealing mold includes: a base 2, the base 2 has an accommodating cavity 24; a cavity frame group, the cavity frame group includes several mutually replaceable cavity frames 5, and several mutually replaceable At least two of the cavity frames 5 have different sizes; each cavity frame 5 can be accommodated in the accommodating cavity 24, and is detachably connected to the base 2; and, the insert 4, The insert 4 is accommodated in the cavity frame 5 and adapted to the inner wall of the cavity frame 5 , so that the surface of the insert 4 near the accommodating cavity 24 and the inner wall of the cavity frame 5 form a plastic-encapsulated cavity.

[0082] It is worth pointing out that the different dimensions of the cavity frame 5 in this embodiment means that the internal accommodation space is different (so as to produce plastic products with different plastic sealing requirements). In practical applications, since this cavity fra...

Embodiment 2

[0084] Such as Figure 1-10 As shown, on the basis of the above-mentioned embodiment, at least two cavity frames 5 have different sizes along the frame depth direction among several interchangeable cavity frames 5; each cavity frame 5 can be accommodated in It is accommodated in the cavity 24 and is detachably connected with the base 2; and, the insert 4 is accommodated in the cavity frame 5 and is adapted to the inner wall of the cavity frame 5, so that the insert 4 is close to the set The surface on the side of the outer surface 25 of the accommodating cavity 24 and the inner wall of the cavity frame 5 form a plastic-encapsulated cavity. The manufacturer can process the product to be plastic-sealed (or the product to be plastic-sealed) by replacing the cavity frame 5 with different frame depths according to the film thickness of the plastic-sealed product, which greatly simplifies the operation process and complexity of mold replacement.

Embodiment 3

[0086] Such as Figure 1-10 As shown, on the basis of the above-mentioned embodiment, at least one cavity frame 5 includes several (at least two) sub-cavity frames, and each sub-cavity frame is provided with a sub-insert 4 adapted to it; so that The surface of the sub-insert 4 near the outer surface 25 and the inner wall of the sub-cavity frame form a sub-molding cavity. Like this, at least two kinds of cavity frames 5 are included in the cavity frame group. The cavity frame 5 of the sub-cavity frame, the second type of cavity frame 5 only contains one sub-cavity frame, and the film thickness of the above two cavity frames 5 is different, while the frame depth of the same type of cavity frame 5 If they are the same, the plastic sealing mold can process two kinds of plastic sealing products with different film thicknesses and different sizes; when there are only two kinds of cavity frames 5 in the cavity frame group, the first type of cavity frame 5 (including at least one cav...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a plastic packaging mould and a plastic packaging method. The plastic packaging mould comprises a pedestal, a mould cavity frame group and inserts, wherein the pedestal is equipped with an accommodating cavity; the mould cavity frame group comprises a plurality of mould cavity frames which can be replaced mutually, and the dimensions of at least two mould cavity frames among the mould cavity frames which can be replaced mutually are different; each mould cavity frame can be accommodated in the accommodating cavity, and is detachably connected with the pedestal; the inserts are accommodated in the mould cavity frames and are adaptive to the inner walls of the mould cavity frames, so that the surfaces, close to sides of the accommodating cavities, of the inserts and the inner walls of the mould cavity frames define plastically packaged mould cavities. The plastic packaging mould can be used for processing plastically packaged products of different needs, and reduces the manufacturing cost of the plastically packaged products; and a machine table utilization rate of the plastic packaging mould is further increased, so that production efficiency and productive efficiency of the plastic packaging mould are improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor plastic packaging, in particular to a plastic packaging mold and a plastic packaging method. Background technique [0002] Injection molding machine is one of the indispensable tools in the back-end process of semiconductor packaging. During injection molding, place the semiconductor part to be plastic-encapsulated in the injection molding tank, match the corresponding upper mold with the lower mold, and then inject the plastic package into the injection tank, and complete the packaging of the semiconductor after the plastic package cools down . [0003] However, the injection groove of the existing packaging mold has only a single initial depth, so the thickness, length and width of the semiconductor package obtained by using this packaging mold are also single. Obviously, for different semiconductor package requirements (thickness, length, width), it is necessary to make a new package mo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B29C45/37B29C45/32B29C45/14
CPCB29C45/14B29C45/32B29C45/376
Inventor 罗伯特.加西亚周小磊黄林芸
Owner HUANWEI ELECTRONICS SHANGHAI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com