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Imvite-modified imine epoxy adhesive and preparation method

A technology of imide epoxy glue and montmorillonite, which is applied in the direction of epoxy resin glue, adhesive, adhesive additive, etc., can solve the problems affecting product stability and industrial application restrictions, and achieve easy industrial production and stable product performance , good toughening effect

Inactive Publication Date: 2018-02-23
HESHAN YIXIN CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the simple addition will cause the settlement of montmorillonite, which will affect the stability of the product, and its industrial application has been greatly restricted.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] (1) Mix 50 parts of CYD128 epoxy resin and 50 parts of AFG-90 epoxy resin, heat to 100℃, and stir for 2h;

[0022] (2) Add 50 parts of polyamic acid and react at 100°C for 4 hours until the material is basically transparent;

[0023] (3) Cool down to 50°C, add 5 parts of montmorillonite, and stir for 2h;

[0024] (4) Cool down to room temperature, add 25 parts of curing agent T-31 and stir evenly to obtain montmorillonite modified imine epoxy adhesive.

[0025] The mechanical properties of the adhesive prepared in Example 1 are shown in Table 1. The shear strength is in accordance with GB 7124-86, tested with a universal material testing machine, and the impact strength is in accordance with GB / T 2567 2008, with a ZBC-4 pendulum impact Test machine test.

[0026] Table 1

[0027] Performance item

Embodiment 2

[0029] (1) Mix 50 parts of CYD128 epoxy resin and 50 parts of AFG-90 epoxy resin, heat to 100°C and stir for 2h;

[0030] (2) Add 55 parts of polyamic acid and react at 100°C for 4 hours until the material is basically transparent;

[0031] (3) Cool down to 50°C, add 8 parts of montmorillonite, and stir for 2h;

[0032] (4) Cool down to room temperature, add 27 parts of curing agent T-31, stir evenly to obtain montmorillonite modified imine epoxy adhesive. The mechanical properties of the adhesive prepared in Example 2 are shown in Table 2.

[0033] Table 2

[0034] Performance item

Embodiment 3

[0036] (1) Mix 50 parts of CYD128 epoxy resin and 50 parts of AFG-90 epoxy resin, heat to 100°C and stir for 2h;

[0037] (2) Add 60 parts of polyamic acid and react at 100°C for 4 hours until the material is basically transparent;

[0038] (3) Cool down to 50°C, add 10 parts of montmorillonite, and stir for 2h;

[0039] (4) Cool down to room temperature, add 30 parts of curing agent T-31 and stir evenly to obtain montmorillonite modified imine epoxy adhesive. The mechanical properties of the adhesive prepared in Example 3 are shown in Table 3.

[0040] table 3

[0041] Performance item

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Abstract

The invention discloses an imvite-modified imine epoxy adhesive. The imvite-modified imine epoxy adhesive is characterized by being prepared from the following raw materials in parts by weight: 50 parts of CYD128 epoxy resin, 50 parts of AFG-90 epoxy resin, 50-80 parts of polyamide acid, 5-15 parts of imvite and 25-40 parts of a curing agent T. After the imine for the epoxy adhesive is modified, the epoxy application range can be broadened, and by further adding imvite, the mechanical property of the imvite can be further strengthened. According to the imvite-modified imine epoxy adhesive, thepreparation process is simple, the industrial production is easy, and the agglomeration of the imvite cannot happen.

Description

Technical field [0001] The invention relates to the technical field of adhesives, in particular to a montmorillonite modified imine epoxy adhesive and a preparation method. technical background [0002] Adhesive refers to a kind of natural or synthetic, organic or inorganic substance that can connect two or more parts or materials together through the adhesion and cohesion of the interface. It is also called adhesive , Customarily referred to as glue. In short, an adhesive is a substance that binds the adherends together through adhesion. "Adhesive" is a general standard term that also includes other glues, mortars, mortars, pastes, etc. Among them, epoxy adhesive is the largest and most widely used. However, since the maximum working temperature of unmodified epoxy adhesive is generally only about 150℃, it has disadvantages such as low heat resistance, high brittleness, and inability to withstand the action of strong polar solvents or chemical media such as aviation lubricant...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J179/08C09J11/04
CPCC08L2205/025C08L2205/03C09J11/04C09J163/00C09J179/08C08L63/00C08L79/08C08K9/02C08K9/06C08K3/346
Inventor 谈志刚
Owner HESHAN YIXIN CHEM CO LTD
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