Novel resistance welding developing solution and method for preparing same

Abstract

The invention provides novel resistance welding developing solution. The novel resistance welding developing solution comprises alkali metal carbonate, alkali metal hydroxide and alkali metal metasilicate. The alkali metal carbonate is at least one of potassium carbonate and sodium carbonate, the alkali metal hydroxide is at least one of potassium hydroxide and sodium hydroxide, and the alkali metal metasilicate comprises sodium metasilicate, potassium metasilicate, sodium water glass, potassium water glass and the like. A method for preparing the novel resistance welding developing solution includes steps of adding industrial purified water into a container; proportionally weighing various reagents, adding the reagents into the container at the previous step, regulating the potential of hydrogen and stirring the reagents until the reagents are completely dissolved. The novel resistance welding developing solution and the method have the advantages that the trough change frequencies can be reduced by the aid of the novel resistance welding developing solution, accordingly, the production efficiency can be improved, and the problem of calcium and magnesium crystallization due to thetraditional developing solution trough walls can be solved; the novel resistance welding developing solution is long in shelf life, difficult to deteriorate, good in developing capacity and suitablefor quick mass production, technical processes for producing products are simple, and input of expensive equipment can be omitted.

Description

technical field [0001] The invention belongs to the technical field of developer, and in particular relates to a novel solder resist developer and a preparation method thereof. Background technique [0002] At present, most printed circuit board factories have to go through the process of exposure and development in the process of manufacturing circuit boards. Only after this process can the next "graphic copper plating" process be carried out. However, before exposure and development, the circuit board must be covered with a layer of polymer film according to the engineering design. This polymer film is exposed and developed after being irradiated with ultraviolet light. The exposed film is called a developing film. This developing film must be completely removed in the next step of the process. If it is not removed or not cleaned, then in the subsequent step of the graphic copper plating process, the residual developing film will be mixed in the copper layer, which will ca...

AI Technical Summary

Problems solved by technology

Yet the used reagent of this invention is more, and cost is higher, is unfavorable for popularization and application

[0004] In summary, there is still a lack of a developer solution that is low in cost, easy to prepare and more environmentally friendly.

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