Supercharge Your Innovation With Domain-Expert AI Agents!

Printed circuit board with reliability-improved embedded resistor and manufacturing method thereof

A technology for printed circuit boards and manufacturing methods, which is applied in the manufacture of printed circuits, removal of conductive materials by chemical/electrolytic methods, printed circuits, etc., can solve the problems of resistance layer damage, low resistivity, resistance changes, etc. The effect of electrical performance

Pending Publication Date: 2018-02-27
QUZHOU SUNLORD CIRCUIT BOARD CO LTD
View PDF13 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the low resistivity of the nickel-phosphorus alloy used as the resistance layer, in order to achieve a specific resistance value, the thickness of the resistance layer is generally <10 microns, which is easily broken during production or subsequent use, resulting in resistance changes; and The resistors made by the above method have stress concentration points in the structure, and these stress concentration points are more likely to cause damage to the resistance layer, causing potential risks in the long-term reliability of the resistance layer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board with reliability-improved embedded resistor and manufacturing method thereof
  • Printed circuit board with reliability-improved embedded resistor and manufacturing method thereof
  • Printed circuit board with reliability-improved embedded resistor and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Such as image 3 As shown, the printed circuit board that improves the reliability of the embedded resistance includes a circuit board body 1, and the circuit board body 1 includes an insulating dielectric layer 2, a resistance layer 3, a resistance protection layer 4 and at least two conductor layers 5, where The resistance layer 3 is directly covered on the upper surface of the insulating medium layer 2, the conductor layer 5 is distributed and arranged on the upper surface of the resistance layer 3 in turn, and the resistance protection layer 4 is located at the junction of the resistance layer 3 and the conductor layer 5.

[0033] Further, the cross section of the resistance protection layer 4 is a right-angled triangle structure whose hypotenuse is a concave curve, and in order to ensure strength, the top of the resistance protection layer 4 is flush with the upper surface of the conductor layer 5 or the upper surface of the resistance layer 3 .

[0034] Wherein, ...

Embodiment 2

[0040] Such as Figure 4 As shown, the structure, principle and implementation steps of this embodiment are similar to those of Embodiment 1, the difference is that the conductor layer 5 here is directly and successively distributed on the upper surface of the insulating medium layer 2, and the resistance layer 3 is covered on the conductor layer. 5, and the middle part of the resistance layer 3 has a bent part bent downward, and the resistance protection part is located on both sides of the upper end of the bent part.

[0041] The method of this embodiment includes the following steps: 1. Making an inner layer plate, including preparing an insulating medium layer 2 and laminating a conductor layer 5 that does not contain a resistance layer 3 on the upper surface of the insulating medium layer 2; 2. Making a conductor circuit, including Paste the first photoresist layer on the conductive layer body, perform the first exposure, the first development, the first etching, and the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of circuit board processing and manufacturing, particularly relates to a printed circuit board with a reliability-improved embedded resistor and a manufacturing method thereof, and solves the technical problem of poor stability of the existing printed circuit board with the embedded resistor. The printed circuit board with the reliability-improved embedded resistor includes a circuit board body, and the circuit board body includes an insulating dielectric layer, a resistor layer, a resistor protection layer and at least two conductor layers, whereinthe resistor layer is directly disposed on the upper surface of the insulating dielectric layer, the conductor layers are sequentially disposed on the resistor layer, the resistor protection layer islocated at the joint of the resistor layer and the conductor layers, or the conductor layers are directly and sequentially disposed on the upper surface of the insulating dielectric layer, the resistor layer covers on the upper surfaces of the conductor layers, the middle of the resistor layer is provided with a bent portion which is downward, and resistor protection portions are located at bothsides of the upper end of the bent portion. The printed circuit board with the reliability-improved embedded resistor and the manufacturing method thereof have the advantage that a stress concentration point is eliminated by use of the resistor protection layer to greatly improve the reliability and electrical stability of the resistor.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing and manufacturing, and in particular relates to a printed circuit board which improves the reliability of embedded resistors and a manufacturing method thereof. Background technique [0002] With the development of the electronic information industry, higher requirements have been put forward for the packaging density and volume quality of electronic information products, and embedding passive devices into printed circuit boards is a very effective solution, and it has naturally become a A hotspot in the development of the printed circuit board industry. Among them, embedding resistors has become the most important product direction. Its advantages are to increase the mounting space on the surface of printed circuit boards. By adopting embedding technology, the reliability of embedded components is better, and by canceling patches and plug-ins The parasitic inductance and capacit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/16H05K3/06
CPCH05K1/167H05K3/06H05K2203/1377
Inventor 石林国白耀文胡斐
Owner QUZHOU SUNLORD CIRCUIT BOARD CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com