Intelligent packaging device for packaging piezoelectric ceramics

A technology for packaging equipment and electric ceramics, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, etc., can solve problems such as cracking of piezoelectric ceramics, potential safety hazards, and low efficiency, so as to improve packaging efficiency and safety , the effect of enhanced practicality

Inactive Publication Date: 2018-03-02
合肥广能新材料科技有限公司
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Problems solved by technology

[0003] Among them, piezoelectric ceramics are information functional ceramic materials that can convert mechanical energy and electrical energy into each other. The existing piezoelectric ceramic packaging is mainly packaged by manpower, which is time-consuming and laborious, and the collision gen

Method used

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  • Intelligent packaging device for packaging piezoelectric ceramics
  • Intelligent packaging device for packaging piezoelectric ceramics
  • Intelligent packaging device for packaging piezoelectric ceramics

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[0027] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the present invention in a schematic manner, so they only show the structures related to the present invention.

[0028] like figure 1 As shown, an intelligent packaging device for packaging piezoelectric ceramics includes a base 1, a first connection block 11, a rotating shaft 15, a lifting mechanism, a stretching mechanism and two packaging mechanisms, the lifting mechanism is arranged on the base 1, the first connecting block 11 is located above the lifting mechanism, the lifting mechanism is drivingly connected with the first connecting block 11, and two packaging mechanisms are respectively arranged on both sides of the first connecting block 11, and the packaging mechanism is connected with the first connecting block 11. The first connecting block 11 is connected...

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Abstract

The invention relates to an intelligent packaging device for packaging piezoelectric ceramics. The intelligent packaging device comprises a base, a first connecting block, a rotating shaft, a liftingmechanism, a stretching mechanism and two packaging mechanisms. The lifting mechanism includes a driving component, a fixing block, a sliding block, a first sliding chute, a telescopic frame and a topplate. The packaging mechanism includes a connecting rod, a second connecting block, a vertical plate and a package assembly. The intelligent packaging device for packaging the piezoelectric ceramicslifts the piezoelectric ceramic required to be packaged by using the stretching mechanism in order to expose the bottom of the piezoelectric ceramic, and then packages the piezoelectric ceramic by using the packaging mechanisms, thereby improving packaging efficiency. Compared with a traditional stretching mechanism, the stretching mechanism drives through a lead screw so as to stably move a lifting block. The height is controlled by the lifting mechanism so that the collision between the piezoelectric ceramic and other articles is avoided. Therefore, the security of the intelligent packagingdevice is improved, and the practicality of the intelligent packaging device is greatly enhanced.

Description

technical field [0001] The invention relates to the field of new material equipment, in particular to an intelligent packaging equipment for packaging piezoelectric ceramics. Background technique [0002] New materials refer to some materials that are newly developed or under research and development, and have superior performance, which have better performance than traditional materials. In recent years, new materials have been paid more and more attention, and the country also attaches great importance to the development of new materials industry. New materials include graphene, high-performance composite fibers, optoelectronic ceramics, piezoelectric ceramics, nanomaterials and superconducting materials, etc. [0003] Among them, piezoelectric ceramics are information functional ceramic materials that can convert mechanical energy and electrical energy into each other. The existing piezoelectric ceramic packaging is mainly packaged by manpower, which is time-consuming an...

Claims

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Application Information

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IPC IPC(8): H01L41/23
CPCH10N30/02
Inventor 冯云
Owner 合肥广能新材料科技有限公司
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