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High-heat-conductivity organic silicon composite material and preparation method thereof

A composite material, silicone technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of short service life, easy volatility, damage to electronic components, etc., to improve thermal conductivity, non-corrosive, Good bond strength

Inactive Publication Date: 2018-03-09
HUIZHOU KINGBALI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The prior art has reported the preparation and performance of condensation-type one-component thermally conductive adhesive materials. One-component thermally conductive adhesives are widely used in the LED field, but the reaction will produce small molecules such as methanol, ethanol, acid, etc., which are volatile and corrosive. Sexual substances, will cause damage to electronic components, short service life, etc.

Method used

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  • High-heat-conductivity organic silicon composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0030] A method for preparing a high thermal conductivity silicone composite material, comprising the following steps:

[0031] A component:

[0032] Step 1: Use a coupling agent to treat the surface of the thermally conductive filler, stir and disperse it, so that the surface of the thermally conductive filler is evenly coated with a layer of coupling agent, and enhance the compatibility between the filler and the silicone resin matrix;

[0033] Step 2: Put the treated thermally conductive filler, silicone resin, and curing agent into a disperser for mixing, and stir and disperse for 1 to 60 minutes;

[0034] Step 3: Encapsulate the mixed materials;

[0035] B component:

[0036] Step 1: Use a coupling agent to treat the surface of the thermally conductive filler, stir and disperse it, so that the surface of the thermally conductive filler is evenly coated with a layer of coupling agent, and enhance the compatibility between the filler and the silicone resin matrix;

[003...

Embodiment

[0039] Embodiment: including four embodiments

[0040] The proportioning of each raw material in its A component is:

[0041] Table 1

[0042] Element

Example 1

Example 2

Example 3

Example 4

Silicone resin

30

15

11

9

Heat conduction agent

67.7

82.7

86.7

88.7

Hardener

0.3

0.3

0.3

0.3

Other additives

2

2

2

2

[0043] The raw material formulations of the four examples in Table 1 were prepared according to the preparation method of component A in the above preparation method.

[0044] The proportioning of each raw material in its B component is:

[0045] Table 2

[0046] Element

Example 1

Example 2

Example 3

Example 4

Silicone resin

30

15

11

9

Heat conduction agent

67.7

82.7

86.7

88.7

Hardener

0.3

0.3

0.3

0.3

Other additives

2

2

2

2

...

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PUM

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Abstract

The invention discloses a high thermal conductivity organic silicon composite material and a preparation method thereof, comprising A component and B component. The A component mainly includes the following raw materials in parts by weight: 10-30 parts by weight of organic silicon resin, 50-30 parts by weight of heat-conducting agent 90, curing agent 0.05-3, other additives 0.1-8; the B component mainly includes the following raw materials in parts by weight: silicone resin 10-30, thermal conductive agent 50-90, catalyst 0.05-3, other additives 0.1 ~8. The formula of the present invention uses silicone resin, thermally conductive filler, coupling agent and other additives to prepare thermally conductive composite materials with excellent mechanical properties and excellent thermally conductive effects through pre-mixing vacuum and filling processes, which are widely used in electronics, automobiles, LEDs, etc. lamps and other fields.

Description

technical field [0001] The invention relates to a high thermal conductivity organic silicon composite material and a preparation method thereof. Background technique [0002] Silicone products are based on silicon-oxygen (Si-O) bonds as the main chain structure, so silicone products have the characteristics of high thermal stability, high weather resistance, electrical insulation performance, low surface tension and low surface energy, and physiological inertia. , due to the above-mentioned excellent properties of silicone, its application range is very wide. It is not only used as a special material in aviation, cutting-edge technology, and military technology departments, but also in various sectors of the national economy. Its application range has expanded to: construction, electronics, textiles, automobiles, machinery, leather and paper, chemical industry Metals and paints, medicine and medical treatment, etc. [0003] Researchers at home and abroad have carried out a...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/05C08K9/10C08K3/22C08K3/28C08K3/38C08K3/34C09K5/14
CPCC08L83/04C08L2203/206C08L2205/025C08L2205/03C09K5/14C08K9/10C08K2003/2227C08K2003/222C08K2003/282C08K2003/385C08K3/34C08K2003/2296
Inventor 张立强
Owner HUIZHOU KINGBALI TECH