Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of pre-embedded adhesive for composite board and preparation method thereof

A composite board and pre-embedded technology, which is applied in the direction of adhesive, adhesive type, epoxy resin glue, etc., can solve the problem of inflexibility of fixed pre-embedded blocks, and achieve excellent high and low temperature resistance, good flame retardancy, excellent anti-corrosion The effect of torsional strength

Active Publication Date: 2021-01-08
上海海鹰粘接科技有限公司
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The introduction and application of pre-embedded glue can effectively solve the subsequent application of various temporary screw implantation requirements for composite panels, and overcome the inflexibility of the original technology for fixed pre-embedded blocks.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of pre-embedded adhesive for composite board and preparation method thereof
  • A kind of pre-embedded adhesive for composite board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0045] A composite board embedded glue and a preparation method thereof, the method comprising the following steps:

[0046] First component preparation method

[0047] (1) Preheat 60kg of 6101 epoxy resin and 12kg of polyurethane modified epoxy resin in the formula, and keep it at 80-100°C for at least 4 hours.

[0048] (2) Put 60kg of 6101 epoxy resin, 12kg of polyurethane modified epoxy resin, and 7.5kg of butyl glycidyl ether into the wall-scraping planetary mixer, start the revolution and disperse stirring, stir and heat to 80-100°C.

[0049] (3) Keep stirring and put 6kg of fumed white carbon black into the mixer gradually and slowly. After the feeding is completed, continue to stir for about 1 hour, and vacuumize for degassing.

[0050](4) Turn off the vacuum, open the feeding port, and keep stirring. Put 1.5kg of reinforcing filler aramid fiber, 30kg of iron powder, 10kg of phosphorus-nitrogen composite flame retardant, and 100kg of flame retardant aluminum hydroxide ...

Embodiment 2

[0064] A kind of high-strength epoxy honeycomb glue and preparation method thereof, the method comprises the following steps:

[0065] First component preparation method

[0066] (1) Preheat 55kg of 618 epoxy resin and 15kg of CTBN modified epoxy resin in the formula, and keep it at 80-100°C for at least 4 hours.

[0067] (2) Put 55kg of 618 epoxy resin, 15kg of polyurethane modified epoxy resin, and 10kg of ethylene glycol bisglycidyl ether required by the formula into the wall-scraping planetary mixer, start the revolution and disperse stirring, stir and heat to 80-100°C.

[0068] (3) Keep stirring and put 8kg of organic bentonite into the mixer gradually and slowly. After the feeding is completed, continue stirring for about 1 hour, and vacuumize for degassing.

[0069] (4) Turn off the vacuum, open the feeding port, and keep stirring. Put 2kg of reinforcing filler aramid fiber powder, 20kg of aluminum powder, 20kg of iron powder, 10kg of phosphorus-nitrogen composite fla...

Embodiment 3

[0082] A kind of pre-embedded glue for composite boards, when used, the first component and the second component are mixed at a weight ratio of 2:1,

[0083] The first component is prepared from the following raw materials in parts by weight: epoxy resin 20, modified epoxy resin 1, reactive diluent 1, reinforcing filler 5, flame retardant 20, thixotropic agent 0.3,

[0084] The second component is prepared by using the following raw materials in parts by weight: toughening curing agent 50, hardening curing agent 10, coupling agent 0.3, thixotropic agent 0.3.

[0085] In the present embodiment, the epoxy resin used is bisphenol A type epoxy resin, the modified epoxy resin is phenolic modified epoxy resin, and the active diluent is ethylene glycol bisglycidyl ether of bisepoxy group, supplemented The strong filler is calcium sulfate whisker, the flame retardant is magnesium hydroxide, and the thixotropic agent is organic bentonite. The toughening and curing agent is aromatic po...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
compressive strengthaaaaaaaaaa
Login to View More

Abstract

The invention relates to a composite plate pre-embedding adhesive and a preparation method thereof. During use of the composite plate pre-embedding adhesive, a first component and a second component are mixed according to a weight ratio of (2 to 4) to 1; the first component is prepared from the following constituent raw materials in parts by weight: 20 to 45 of epoxy resin, 1 to 10 of modified epoxy resin, 1 to 10 of activated diluents, 5 to 20 of reinforcing filler, 20 to 70 of a flame retardant and 0.3 to 10 of a thixotropic agent; the second component is prepared from the following constituent raw materials in parts by weight: 50 to 90 of a toughening curing agent, 10 to 20 of a hardening curing agent, 0.3 to 1 of a coupling agent and 0.3 to 15 of a thixotropic agent. Compared with theprior art, the composite plate pre-embedding adhesive has the advantages of extremely high rigidity, toughness and the like.

Description

technical field [0001] The invention relates to a pre-embedded glue and a preparation method thereof, in particular to a composite board pre-embedded glue and a preparation method thereof. Background technique [0002] With the continuous development of high-speed rail technology, a large number of sandwich composite structural materials are widely used, and the middle of a large number of sandwich composite structural materials is generally a honeycomb structure, and the overall plate has excellent tensile and compressive bending strength. The screw cannot achieve the desired strength, mainly because the hollow structure cannot cover the screw so that the screw is in a suspended state. The conventional solution is to embed pre-embedded solid blocks (aluminum blocks, bakelite blocks, etc.) The board is made by composite, it is difficult to change the structure, and if the position of the threaded hole is not accurate, there will be defects in the product delivery, and some ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/06C09J11/04
CPCC08K2201/011C08K2201/014C08L2201/02C08L2201/08C08L2205/025C08L2205/03C08L2205/035C08L2205/16C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08L77/10C08K13/02C08K2003/2227C08K2003/0856C08K3/36C08K13/06C08K2003/2224C08K7/08C08K3/346C08L91/00
Inventor 樊利东李厚堂刘俊
Owner 上海海鹰粘接科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com