Silicon hollow beam, silicon microaccelerometer based on silicon hollow beam, and preparation method thereof

Abstract

The invention discloses a silicon hollow beam, a silicon microaccelerometer based on the silicon hollow beam, and a preparation method thereof. The silicon hollow beam comprises a beam body produced by performing dry etching on SOI silicon chips, and the cross section of the beam body is hollow. The microaccelerometer comprises a silicon sensitive structure and a silicon substrate, which are connected into one body. The silicon sensitive structure comprises a support beam and a sensitive mass block assembly. The cross section of the support beam is the said silicon hollow beam, and the sensitive mass block assembly is fixed to a mooring anchor through the support beam. The preparation method comprises the steps of adopting the silicon sensitive structure prepared by dry etching; bonding the silicon sensitive structure and the silicon substrate having a capacitance plate assembly and a lead wire electrode by adopting silicon-silicon low stress bonding, and obtaining the microaccelerometer. The invention is advantageous in that anti-interference capability is strong, device area is small, yield rate is high, cost is low, stability is high, processing quality is high, processing robustness is good, and application scope is wide.

Description

technical field [0001] The invention relates to silicon microsensor technology, in particular to a silicon hollow beam, a silicon micro accelerometer based on the silicon hollow beam and a preparation method thereof. Background technique [0002] Accelerometers are mainly used to measure the motion parameters of moving objects relative to inertial space. Compared with traditional acceleration, MEMS micro-accelerometer technology has the characteristics of small size, low power consumption, and easy batch processing, so it quickly becomes a research hotspot, and its performance is constantly improving, and it is widely used in military and civilian fields. [0003] At present, foreign uniaxial micro-accelerometer products have matured and been widely used. Domestic research and development of uniaxial micro-accelerometers are also increasing, and some laboratories have developed high-performance engineering. However, how to manufacture a single-axis micro-accelerometer with ...

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Problems solved by technology

However, the ability to resist modal interference is poor, the noise is large, and the temperature characteristics and robustness are limited by its own structure.

[0004] Chinese patent documents with patent application numbers 201410825011.3 and 201410606833.2 disclose two types of micro-machined accelerometers, but the micro-accelerometers in the two schemes are single support beam structures, and there is a problem that the bending mode of the support beam is greatly disturbed; and the two The solutions are all prepared by wet etching process, which has problems such as large device area, low yield and high processing cost.

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