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An OLED display panel and packaging method thereof

A technology for display panels and mask plates, applied in organic semiconductor devices, electric solid devices, semiconductor devices, etc., can solve the problems of poor packaging effect of OLED display panels, achieve the effect of improving packaging effect and prolonging service life

Active Publication Date: 2019-05-14
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides an OLED display panel and a packaging method thereof to at least partly solve the problem of poor packaging effect of the OLED display panel

Method used

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  • An OLED display panel and packaging method thereof
  • An OLED display panel and packaging method thereof
  • An OLED display panel and packaging method thereof

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Embodiment Construction

[0034] The technical solutions in the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Apparently, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] figure 1 It shows a schematic structural view of the peripheral area of ​​the OLED display panel provided by the embodiment of the present invention, as shown in figure 2 As shown, the OLED display panel includes a substrate layer 1, and also includes a first organic film layer 2, a metal film layer 3 and a second organic film layer 4 sequentially formed on the substrate layer 1, at the periphery of the OLED display panel area, the orthographic projection of the metal film layer 3...

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Abstract

The invention provides an OLED display panel and a packaging method thereof. By sequentially forming a first organic film layer, a metal film layer and a second organic film layer on a substrate layer, in the peripheral area of ​​the OLED display panel, the width of the metal film layer is greater than The width of the first organic film layer, thus forming an inverted trapezoidal undercut structure, the angle between the edge of the first organic film layer and the metal film layer is small, if the inorganic film layer is further formed later, the inorganic film layer is at this position In this way, when laser cutting is used, the cracking of the inorganic film layer will end at this position, and the cracks and gaps will not continue to extend to the inside of the film layer, preventing water vapor from entering the OLED display panel. , thereby improving the encapsulation effect and prolonging the service life of the OLED device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an OLED display panel and a packaging method thereof. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) devices have become a very Competitiveness and prospects for next-generation display technologies. The organic light-emitting materials and cathode materials used in OLED devices are particularly sensitive to water and oxygen. Excessive moisture or high oxygen content will affect the service life of OLED devices. In order to effectively block the influence of water and oxygen on OLED devices, it is necessary to encapsulation. [0003] Organic film has many advantages such as low dielectric constant, good flatness, large thickness range, high transmittance, and good water vapor barrier performance, which makes organic film technology develop rapidly and is widely used in the packaging process of OLED display panels. [0004] In t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56H01L27/32H10K99/00
CPCH10K59/8722H10K59/8731Y02E10/549H10K71/851H10K71/00H10K50/844H10K50/8426H10K50/8445H10K77/10
Inventor 吕志军张锋张世政党宁董立文刘文渠
Owner BOE TECH GRP CO LTD